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RISS 인기검색어
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- 저자 : Guifu Ding (검색결과 5 건)
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Improved Performances of AlN/Polyimide Hybrid Film and its Application in Redistribution Layer
Zhe Liu,Guifu Ding,Jiangbo Luo,Wen Lu,Xiaolin Zhao,Ping Cheng,Yanlei Wang 대한금속·재료학회 2016 ELECTRONIC MATERIALS LETTERS Vol.12 No.5
The AlN/polyimide (PI) hybrid film was studied as thedielectric layer in the redistribution layer (RDL) in this work. The incorporation of the AlN into the PI matrix was achievedby mechanical ball-milling process. The spin-coating processwas used to fabricate the AlN/PI hybrid film, which iscompatible with micro-electro-mechanical system (MEMS)technology for fabricating RDL. The AlN/PI hybrid film wascharacterized by Fourier transform infrared (FTIR) spectrumand thermogravimetric analysis (TGA). The effect of the AlNcontent on the thermal stability, thermal expansion coefficient,hardness and water adsorption of the AlN/PI hybrid film wasstudied. The results indicated that the addition of AlN nanoparticlesimproved the thermal stability and hardness, butdecreased the thermal expansion coefficient and waterabsorption of the pure PI film. As an example of its typicalapplication, the AlN/PI hybrid film with 8 wt.% AlN waspatterned using micromachining technology and used as thedielectric layer in RDL successfully.
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Yanmei Liu,Yunna Sun,Yan Wang,Guifu Ding,Bin Sun,Xiaolin Zhao 대한금속·재료학회 2017 ELECTRONIC MATERIALS LETTERS Vol.13 No.1
A complex reinforced polymer interposer comprised with conductive Nicylinders, ordered Ni grid and SiC nano-whiskers/Polyimide (PI)composite was proposed. The conductive Ni cylinders distributing in themiddle of each Ni grid unite designed as the supporting structure wereused as electric connecting component for the interposer and wereinsulated by the SiC nano-whiskers/PI composite. The comprehensiveproperties of the complex reinforced polymer interposer were improvedby a complex reinforced mechanism: the improved thermal conductivityand mechanical strength by the Ni supporting structure and the reducedmetal/polymer interfacial mismatch due to the SiC nano-whiskers/PIcomposite with the optimized mixture ratio. The above complexreinforced polymer interposer and a traditional reinforced polymerinterposer only with Ni grid were fabricated using micro-machiningtechnology for comparative analysis. The comprehensive properties ofthese two polymer interposers were analyzed respectively. Comparedwith the traditional design, the comprehensive properties of the proposedcomplex reinforced polymer interposer were improved further, such as,21.3% increase for the Young modulus, 10.1% decrease for thecoefficient of thermal expansion (CTE) and 54.9% increase for thethermal conductivity. Such complex reinforced mechanism based on themetal ordered grid and random nano-whiskers has potential to expandthe applications of the polymer interposer.
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Chen Sizhen,Cai Han,Li Yahui,Zhang Qi,Sun Yunna,Ding Guifu 대한금속·재료학회 2022 ELECTRONIC MATERIALS LETTERS Vol.18 No.5
To meet the heat dissipation requirements of microelectronic devices, it is urgent to develop an efficient method to fabricate a controllable micro/nano structure for the wick in vapor chamber, which is widely investigated for its high thermal conductivity and small size. This work proposed a controllable fabrication of nano-porous copper (NPC) with high efficiency, which includes electrodeposition and dealloying. A uniform Cu–Zn alloy with single phase was prepared as the precursor for dealloying through electrodeposition. An innovative solution system for dealloying was developed for the fabrication of the bi-continuous NPC, in which the efficiency was improved ten times compared to the conventional acid solution. In addition, the effects of dealloying parameters on the NPC morphology and the process efficiency have also been studied systematically. Based on the above method, both good wettability and capillary performance were achieved by NPC with tunable pore size, which indicates its great application prospects in wicks for high-performance vapor chamber.
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Mechanical Property Evaluation of TSV-Cu Micropillar by Compression Method
Ting Gu,Ping Cheng,Su Wang,Huiying Wang,Xuhan Dai,Hong Wang,Guifu Ding 대한금속·재료학회 2014 ELECTRONIC MATERIALS LETTERS Vol.10 No.4
A micro-compression test method was presented to evaluate the mechanical property of the TSV-Cu micropillar in this paper. Firstly, the test sample containing TSV-Cu micropillar was prepared by MEMS micromachining technology. Then, the mechanical property of TSV-Cu micropillar was measured by a self-made micro-compression system. Finally, the effect of thermal treatment on the mechanical property of TSV-Cu micropillar was studied. The experimental results showed that the average yield strength (σ0.2) of the TSV-Cu micropillar was 167 MPa. But it decreased to 137 MPa after being thermally treated at 400°C for 1 hour, which was probably due to the increased grain size of Cu.
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Wenwen Zhou,Yahui Li,Yunna Sun,Jinyuan Yao,Xutong Song,Guifu Ding 대한금속·재료학회 2020 ELECTRONIC MATERIALS LETTERS Vol.16 No.6
SU-8 photoresist has been more and more widely used as a structural material in micro electromechanical system (MEMS) because of its low cost and excellent biocompatibility. However, the inferior mechanical and thermal performances immensely impinge the reliability of the MEMS device based SU-8 and accordingly restrict its application. Here we report the mechanicaland thermal performance of SU-8 reinforced by the multilayer glass fabric with the MEMS technology. The finite element simulation and specific experiment are conducted, which confirm that the reinforced SU-8 composites have a 281% increase in Young’s modulus and a 64% decrease in coefficient of thermal expansion (CTE) compared with pure SU-8. Additionally,the improved mechanism has also been analyzed, including the excellent interface bonding between the SU-8 and glass fabric, and the high-bond energy of Si–O-Si chain structures in glass fabric. Furthermore, the glass fabric reinforced SU-8 could still possess a high light transmittance to maintain the ability of lithography patterning. Therefore, it is believed thatthe strategy proposed here may satisfy higher requirements of MEMS devices, which guarantees its practical applications in the functional microstructures.
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