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CVD and Sputtering-reflow Copper Metalization Technique with CMP
Hoshino, M.,Furumura, Y. The Korean Vacuum Society 1995 Applied Science and Convergence Technology Vol.4 No.s1
We review the copper CVD line, via fill properties, and CMP line resistance. With CVD, trenches and vias with high aspect ratio(above 3) can be filled completely. Sputtering-reflow technique, a new method to filling copper into lines, is also reviewed to compare the CVD process.