http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
α-위치에 작용기를 가지는 Benzylamine의 합성
김흥재,감경희,조수동,안철진,이영근,신동수 Institute of Genetic Engineering Changwon National 1999 Gene and Protein Vol.3 No.1
We have investigated the first synthetic methodology of phthalimide-benzylacetate from benzylphthalimide which are easily prepared to phthalimide as starting material. Phthalimide-benzylacetate was afforded in NBS, sodium acetate, acetic acid and chlorobenzene condition as good yield. Finally, amino(phenyl)methyl acetate(1) was synthesized from phthalimide-benzylacetate under hydrazine monohydrate, acetic acid.
Multiport Measurement Method Using a Two-Port Network Analyzer With Remaining Ports Unterminated
Dong Gun Kam,Joungho Kim THE INSTITUTE OF ELECTRICAL ENGINEERS 2007 Vol. No.
<P>A practical multiport measurement method is presented for the precise characterization of an N-port device using a two-port vector network analyzer. Because the 2 unused ports need not be terminated with matched loads, a test fixture can be simplified. Any influence of the reflections from the unterminated ports can be deembedded by port renormalization. The proposed method was verified with a coupled microstrip line structure.</P>
Dong Gun Kam,Joungho Kim 한국전자파학회 2003 전자파기술 Vol.14 No.1
Differential signaling has become a popular choice for high-speed interconnection schemes on Printed Circuit Boards(PCBs),offering superior immunity to external noise. However, conventional differential transmission lines on PCBs have problems, such as crosstalk and radiated emission. To overcome these, we propose a Twisted Differential Line(TDL) structure on a multi-layer PCB. Its improved immunity to crosstalk noise and the reduced radiated emission has been successfully demonstrated by measurement. The proposed structure is proven to transmit 3. Gbps digital signals with a clear eye-pattern. Furthermore, it is subject to much less crosstalk noise and achieves a 13 dB suppression of radiated emission. Index Terms - Twisted Differential Line, Differential Signaling, Crosstalk, Radiated Emission, Transmission Line, Twisted Pair.
Packaging a 40-Gbps serial link using a wire-bonded plastic ball grid array
Dong Gun Kam,Joungho Kim,Jiheon Yu,Ho Choi,Kicheol Bae,Choonheung Lee IEEE 2006 IEEE design & test of computers Vol.23 No.3
<P>System-in-package provides highly integrated packaging with high-speed performance. Many SiP packages contain low-cost 3D stacked chips interconnected by fine wire bonds. In a high-frequency spectrum, these wire bonds can cause discontinuities causing signal degradation. This article addresses problems with wire bonding in high-frequency SiP packages and proposes design methodologies to reduce these discontinuities</P>
Kam, Dong-Gun,Kim, Joung-Ho The Korean Institute of Electromagnetic Engineerin 2003 전자파기술 Vol.14 No.1
Differential signaling has become a popular choice for high-speed interconnection schemes on Printed Circuit Boards (PCBs), offering superior immunity to external noise. However, conventional differential transmission lines on PCBs have problems, such as crosstalk and radiated emission. To overcome these, we propose a Twisted Differential Line (TDL) structure on a multi-layer PCB. Its improved immunity to crosstalk noise and the reduced radiated emission has been successfully demonstrated by measurement. The proposed structure is proven to transmit 3 Gbps digital signals with a clear eye-pattern. Furthermore, it is subject to much less crosstalk noise and achieves a 13 dB suppression of radiated emission. Index Terms - Twisted Differential Line, Differential Signaling, Crosstalk, Radiated Emission, Transmission Line, Twisted Pair
60 GHz 대역 신호 무결성을 위한 플립 칩 구조 최적화
감동근(Dong Gun Kam) 한국전자파학회 2014 한국전자파학회논문지 Vol.25 No.4
일반적으로 플립 칩은 와이어 본딩에 비해 신호 무결성을 저해하는 기생 성분이 작지만, 60 GHz 대역에서는 설계하기에 따라서 2 dB 이상의 삽입 손실 차이가 난다. 본 논문에서는 플립 칩 구조의 여러 설계 변수들에 따라 삽입 손실이 어떻게 변하는 지를 분석함으로써 설계를 최적화하는 방법을 제시한다. Although flip-chip interconnects have smaller parasitics than bonding wires, they should be carefully designed at 60 GHz. Insertion loss at a flip-chip transition may differ as much as 2 dB depending on design parameters. In this paper we present a comprehensive sensitivity analysis to optimize the flip-chip transition.
Removal of Specific Harmonics by Rise Time Control
Manseok Kwon,Dong Gun Kam [Institute of Electrical and Electronics Engineers 2015 IEEE transactions on electromagnetic compatibility Vol.57 No.5
<P>It is well known that increasing the rise/fall time of a digital signal reduces the high-frequency spectral content, thereby enhancing the chances of meeting regulatory electromagnetic interference (EMI) requirements. Unlike the EMI regulations, most radio-frequency interference (RFI) issues in mobile devices are band limited. Given the growing concern regarding timing constraints of high-speed serial links, increasing the rise time cannot sufficiently suppress a specific harmonic that causes RFI. In this study, we demonstrate that a certain harmonic can be practically removed by making (not necessarily increasing) the rise time a multiple of the reciprocal of that harmonic frequency.</P>
Jinwoo Choi,Dong Gun Kam,Daehyun Chung,Srinivasan, K.,Govind, V.,Joungho Kim,Swaminathan, M. Institute of Electrical and Electronics Engineers 2007 IEEE transactions on advanced packaging Vol.30 No.2
<P>This paper presents near-field (NF) and far-field (FF) analysis of alternating impedance electromagnetic bandgap (AI-EBG) structure in packages and boards. Three test vehicles have been designed and fabricated for NF and FF measurements. Simulation results using a full-wave solver (SONNET) have been compared with measurement results. This paper investigates the radiation due to return current on different reference planes. The analysis results from simulations and measurements provide important guidelines for design of the AI-EBG structure based power distribution network for noise isolation and suppression in mixed-signal systems</P>
A Wideband and Compact EBG Structure With a Circular Defected Ground Structure
Myunghoi Kim,Dong Gun Kam IEEE 2014 IEEE transactions on components, packaging, and ma Vol.4 No.3
<P>We propose a new analysis method to determine the bandgap characteristics of an electromagnetic bandgap structure with a defected ground structure (DGS). The proposed method is based on a 1-D segmented transmission line model and a piecewise linear approximation of Zo within a unit cell. Although the previous method is only applicable to rectangular DGSs (RDGSs), the proposed method is applicable to any DGS shapes. As an example, the proposed method is applied to a circular DGS and shows a good agreement with full-wave simulations of the unit cell and measurements of 11 × 11 unit cells. The circular DGS achieves a 15% improvement in the stopband bandwidth over the RDGS with the same perforation area. The proposed method allows us to explore a variety of DGS shapes in the search for better stopband characteristics. It also offers the basis for numerical optimization techniques to be used in synthesizing DGS shapes to meet required stopband characteristics.</P>