http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
BER and Throughput Analyses of the Analytical Optimum Chip Waveform
Ryu, Heung-Gyoon,Chung, Ki-Ho,Lee, Dong-Hun The Korean Institute of Electromagnetic Engineerin 2002 한국전자파학회논문지 Vol.13 No.7
The study on the chip waveform design to minimize multiple-access interference (MAI) and its performance evaluation are very important since chip waveform decides the signal quality and system capacity of the direct-sequence CDMA wireless communication system. This paper suggests the analytical chip waveform to minimize the MAI. The BER and throughput performances achieved by the proposed analytical optimum chip waveform are compared with those of the conventional chip waveforms in the Nakagami-m distribution frequency selective channel when the differential phase shift keying (DPSK) is employed in DS-CDMA system. From the numerical results, capacity and throughput are improved about 2 times and 1.4 times respectively when it is compared with the Kaiser chip waveform that is considered as one of the best in the conventional ones.
An Inverted-F Antenna for 2,4/5 GHz WLAM Applications
Chae, Gyoo-Soo,Cho, Young-Ki,Lim, Joong-Su The Korean Institute of Electromagnetic Engineerin 2004 한국전자파학회논문지 Vol.15 No.2
본 논문에서는 무선랜용 역 F형 안테나가 소개되었다. 제안된 안테나는 두 개의 가변 공진 모드를 갖는 일반적인 평판 역 F형 안테나를 기본으로 설계되었다. 이 소형 안테나는 금속판을 각인(stamping)하여 제작되었고 노트북의 LCD 양 측면의 보호용 금속 지지대에 장착할 수 있다. 그리고 이 안테나는 2.4 GHz와 5 GHz 대역에서 동작하며 다른 무선통신기기들에도 적용될 수 있다. 모든 실험은 안테나가 실제 측정용 노트북에 장착된 상태에서 이루어졌다. An inverted-F antenna for wireless local area network(WLAN) is presented. The proposed design is based on the typical dual-band planar inverted-F antennas(PIFA), which have two tunable resonant modes. The low-profile antenna is built by stamping and designed to be mounted on the metal frame of the laptop LCD panel. The obtained antenna can perform in 2.4 GHz and 5 GHz bands and be adopted for other wireless applications. All the measurements are performed in the actual test fixture.
New Challenges for Low Cost and High Speed RF ATE System
Song, Ki-Jae,Lee, Ki-Soo,Park, Jongsoo,Lee, Jong-Chul The Korean Institute of Electromagnetic Engineerin 2004 한국전자파학회논문지 Vol.15 No.8
본 논문에서는 RF소자들의 테스트시 비용 절감을 극대화 할 수 있는 저가형 고속 RF 자동화 테스트 시스템(Automatic Test Equipment, ATE)의 제작에 관하여 다루어진다. 제작된 RF ATE는 고속의 스위칭 시간과 고정밀 디지타이저를 포함한 16개의 독립적인 RF 입출력 단자를 갖고 있으며 산업 표준인 VXI(Versus module eXtensions for Instrument)와 GPIB(General Purpose Interface Bus) 인터페이스를 사용하여 구성된다. 또한 소자의 생산효율을 극대화하기 위하여 동시에 4개의 소자를 테스트할 수 있도록 시스템이 구성된다. 마지막으로 현재 가격 경쟁이 상당히 심한 소자 중 하나인 RF 전력증폭모듈올, 제작된 RF ATE를 이용하여 테스트를 진행하여 시스템 성능을 검증한다. This paper presents the implementation of the low cost and high speed RF ATE(Automatic Test Equipment) system, which can be a reasonable solution for reducing the test cost of RF devices. This paper suggests high speed and precise measurement capabilities which are realized by the 16 independent RF ports with high speed switching time and high accuracy digitizer using the industry standard Versus module eXtensions for Instrument(VXI) General Purpose Interface Bus(GPIB) interfaces. Also, the system has the capabilities of quad-site test which can dramatically increase the device throughput. This paper concludes with the demonstration of the implemented ATE system through the setup of RF Power Amplifier Module(PAM), which is under the most competitive market situation.
New Analysis on Reception of M-ary FSK Signals over Rician Fading Channels
Kim, Chang-Hwan,Han, Young-Yearl The Korean Institute of Electromagnetic Engineerin 2000 한국전자파학회논문지 Vol.11 No.7
In this paper, we analyze the distribution of the envelope of the received signal over frequency-nonselective slow Rician fading channels with aadditive white Gaussian noise(AWGN). Especially, we can obtain the error rate performance of noncoherent M-ary FSK(MFSK) over slow and flat Rician fading channels and AWGN from the new probability density function(PDF) of the envelope, not PDF of the instantaneous signal-to-noise ratio(SNR) published before, of the received signal. When coherent MFSK signals experience the Rician fading channel, the performances are derived, using the union bound.
Compact & Contact Quad-Band(DVB-H UHF/L, WLAN 11 a/b) Antenna for PMP Applications
Yang, Chan-Woo,Yeum, In-Su,Jung, Chang-Won The Korean Institute of Electromagnetic Engineerin 2010 Journal of Electromagnetic Engineering and Science Vol.10 No.3
The quad-band antenna, which is composed of two compact dual-band antennas, is presented for potable media player(PMP) applications. The antenna for the broadcasting dual-band(DVB-H UHF; 470-862 MHz, L; 1452-1492 MHz) is composed of a planar inverted F-shaped antenna(PIFA) with an input matching circuit. The antenna for the communication dual-band(WLAN 11 b; 2.4~2.5 GHz, 11 a; 5.15~5.8 GHz) is composed of a folded dipole antenna with enhanced mutual coupling. The proposed antennas are contact with the PMP case($\varepsilon_r$=3.2) which is used as a substrate for the compact design.
Kim, Joohee,Kim, Joungho The Korean Institute of Electromagnetic Engineerin 2013 전자파기술 Vol.24 No.2
In this paper, key design issues and considerations for Signal Integrity(SI) and Power Integrity(PI) of a TSV-based 3D IC are introduced. For the signal integrity and power integrity of a TSV-based 3-D IC channel, analytical modeling and analysis results of a TSV-based 3-D channel and power delivery network (PDN) are presented. In addition, various design techniques and solutions which are to improve the electrical performance of a 3-D IC are investigated.
State of The Art in Semiconductor Package for Mobile Devices
Kim, Jin Young,Lee, Seung Jae The Korean Institute of Electromagnetic Engineerin 2013 전자파기술 Vol.24 No.2
Over the past several decades in the microelectronics industry, devices have gotten smaller, thinner, and lighter, without any accompanying degradation in quality, performance, and reliability. One permanent and deniable trend in packaging as well as wafer fabrication industry is system integration. The proliferating options for system integration, recently, are driving change across the overall semiconductor industry, requiring more investment in developing, ramping and supporting new die-, wafer- and board-level solution. The trend toward 3D system integration and miniaturization in a small form factor has accelerated even more with the introduction of smartphones and tablets. In this paper, the key issues and state of the art for system integration in the packaging process are introduced, especially, focusing on ease transition to next generation packaging technologies like through silicon via (TSV), 3D wafer-level fan-out (WLFO), and chip-on-chip interconnection. In addition, effective solutions like fine pitch copper pillar and MEMS packaing of both advanced and legacy products are described with several examples.
State-of-the-Art mmWave Antenna Packaging Methodologies
Hong, Wonbin The Korean Institute of Electromagnetic Engineerin 2013 전자파기술 Vol.24 No.2
Low-Temperature-cofired ceramics (LTCC) antenna packages have been extensively researched and utilized in recent years due to its excellent electrical properties and ease of implementing dense package integration topologies. This paper introduces some of the key research and development activities using LTCC packaging solutions for 60 GHz antennas at Samsung Electronics [1]. The LTCC 60 GHz antenna element topology is presented and its measured results are illustrated. However, despite its excellent performance, the high cost issues incurred with LTCC at millimeter wave (mmWave) frequencies for antenna packages remains one of the key impediments to mass market commercialization of mmWave antennas. To address this matter, for the first time to the author's best knowledge this paper alleviates the high cost of mmWave antenna packaging by devising a novel, broadband antenna package that is wholly based on low-cost, high volume FR4 Printed Circuit Board (PCB). The electrical properties of the FR4 substrate are first characterized to examine its feasibility at 60 GHz. Afterwards a compact multi-layer antenna package which exhibits more than 9 GHz measured bandwidth ($S_{11}{\leq}-10$ dB) from 57~66 GHz is devised. The measured normalized far-field radiation patterns and radiation efficiency are also presented and discussed.