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Controlled electroplating and electromigration in nickel electrodes for nanogap formation
Los Santos Valladares, Luis De,Leon Felix, Lizbet,Bustamante Dominguez, Angel,Mitrelias, Thanos,Sfigakis, Francois,Khondaker, Saiful I,Barnes, Crispin H W,Majima, Yutaka IOP Pub 2010 Nanotechnology Vol.21 No.44
<P>We report the fabrication of nickel nanospaced electrodes by electroplating and electromigration for nanoelectronic devices. Using a conventional electrochemical cell, nanogaps can be obtained by controlling the plating time alone and after a careful optimization of electrodeposition parameters such as electrolyte bath, applied potential, cleaning, etc. During the process, the gap width decreases exponentially with time until the electrode gaps are completely bridged. Once the bridge is formed, the <I>ex situ</I> electromigration technique can reopen the nanogap. When the gap is ∼ 1 nm, tunneling current–voltage characterization shows asymmetry which can be corrected by an external magnetic field. This suggests that charge transfer in the nickel electrodes depends on the orientation of magnetic moments. </P>
Attaching Thiolated Superconductor Grains on Gold Surfaces for Nanoelectronics Applications
De Los Santos Valladares, Luis,Bustamante Dominguez, Angel,Llandro, Justin,Suzuki, Seiichi,Mitrelias, Thanos,Bellido Quispe, Richard,Barnes, Crispin H. W.,Majima, Yutaka IOP Publishing 2010 Japanese journal of applied physics Vol.49 No.r9