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New Low Firing Capacitor Materials and Their Uses in Microelectronic Applications
Stein, S. J.,Wahlers, R. L.,Bless, P. W.,Dychala, D. H.,Huang, C. Y. D. 한국마이크로전자및패키징학회 1994 Seminar on Hybrid Microelectronics and Multichip P Vol.1 No.1
This paper discusses new tape and thick film capacitor dielectrics having dielectric constants from 1,000 to 12,000 and dissipation factors of about 1%. Their low firing temperature requirements (850 to 930℃) reduce capacitor processing costs and permit the use of silver conductors. In addition, the paper provides a guide to the circuit designer regarding selection of these materials as cost effective alternatives to discrete devices in various microelectronic applications.
송휴섭,장성도,S.J. Bless 한국세라믹학회 1995 한국세라믹학회지 Vol.32 No.3
The ballistic efficiency of alumina tiles with various sizes, shapes, and target configurations was measured by the thick backing plate technique. The ballistic efficiency of square tiles roughly 8 mm thick struck by 12.7mm diameter bullets rapidly increased with tile size up to about 100mm, then tended to saturate. Circular shape tiles had lower ballistic efficiencies than those of square shape tiles for the same width and thickness. Small tiles (50mm) that were recessed in aluminum wells had a significantly higher ballistic efficiency than tiles placed on a flat surface. However, the difference in the ballistic efficiency between the two target configurtions became small at larger tile sizes. All the results could be explained by the effect of reflected waves at edges and the propagation of resulting cracks on the penetration process.