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Argunova, T. S.,Yi, J. M.,Jung, J. W.,Je, J. H.,Sorokin, L. M.,Gutkin, M. Yu.,Belyakova, E. I.,Kostina, L. S.,Zabrodskii, A. G.,Abrosimov, N. V. WILEY-VCH Verlag 2007 Physica status solidi. PSS. A, Applications and ma Vol.204 No.8
<P>The defect structure of Si<SUB>1–x </SUB>Ge<SUB>x </SUB> wafers with 4% of germanium and their interfaces with Si wafers were studied using white radiation topography and phase-sensitive radiography. The heterostructures were manufactured by direct bonding of Si<SUB>1–x </SUB>Ge<SUB>x </SUB> and Si crystalline wafers made of bulk crystals that were grown by the Czochralski technique. In Si<SUB>1–x </SUB>Ge<SUB>x </SUB> crystals, the segregations of Ge act as dislocation nucleation sites. In Si<SUB>1–x </SUB>Ge<SUB>x </SUB>/Si bonded structures, the segregation of Ge as well as the accumulation of dislocations induce elastic strain and plastic deformation during high-temperature bonding annealing. With the topography–radiography combination, we are able not only to detect microcracks, indicating nonbonded areas, by radiography, but also to reveal dislocations and long-range strain fields by topography at the same time. (© 2007 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim)</P>