RISS 학술연구정보서비스

검색
다국어 입력

http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.

변환된 중국어를 복사하여 사용하시면 됩니다.

예시)
  • 中文 을 입력하시려면 zhongwen을 입력하시고 space를누르시면됩니다.
  • 北京 을 입력하시려면 beijing을 입력하시고 space를 누르시면 됩니다.
닫기
    인기검색어 순위 펼치기

    RISS 인기검색어

      검색결과 좁혀 보기

      선택해제

      오늘 본 자료

      • 오늘 본 자료가 없습니다.
      더보기
      • 무료
      • 기관 내 무료
      • 유료
      • Image Segmentation Using OpenMP and Its Application in Plant Species Classification

        M Nordin A Rahman,Ahmad Fakhri Ab. Nasir,Nashriyah Mat,A Rasid Mamat 보안공학연구지원센터 2015 International Journal of Software Engineering and Vol.9 No.5

        Segmentation is very important in early stage of image processing pipelines. Final results of image processing are strongly depending on the initial image segmentation quality. A good quality result often comes at the price of high computational cost including computation speed. Image segmentation requires long computation task caused by sequential processing of huge sizes of image and complex tasks. Nowadays, multi-core architectures are emerging as an attractive platform for parallel processing because it has two or more independent cores in a single physical package and their comparatively low cost. In this paper, two parallelization strategies (fine-grain and coarse-grain approach) are proposed for computing leaf image segmentation. The Canny Edge Detector and Otsu thresholding methods are used due to their wide range of usage for leaf segmentation in plant classification. The implementation is developed under multi-core architecture with shared memory multiprocessors. The OpenMP (Open Multi-Processing), an API (Application Programming Interface) is utilized for writing multi-threaded applications in shared memory architecture. The comparative study with two parallelization strategies is discussed further in this paper.

      • KCI등재

        Evaluation of the Machine Learning Classifier in Wafer Defects Classification

        Jessnor Arif Mat Jizat,Anwar P.P. Abdul Majeed,Ahmad Fakhri Ab. Nasir,Zahari Taha,Edmund Yuen 한국통신학회 2021 ICT Express Vol.7 No.4

        In this paper, an evaluation of machine learning classifiers to be applied in wafer defect detection is described. The objective is to establish the best machine learning classifier for Wafer Defect Detection application. k-Nearest Neighbours (k-NN), Logistic Regression, Stochastic Gradient Descent, and Support Vector Machine were evaluated with 3 defects categories and one non-defect category. The key metrics for the evaluation are classification accuracy, classification precision and classification recall. 855 images were used to train, test and validate the classifier. Each image went through the embedding process by InceptionV3 algorithms before the evaluated classifier classifies the images.

      연관 검색어 추천

      이 검색어로 많이 본 자료

      활용도 높은 자료

      해외이동버튼