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Electromigration에 의한 Sn-0.7Cu 솔더 금속간화합물 성장 예측
허민혁 ( Min-hyeok Heo ),강남현 ( Namhyun Kang ),박성훈 ( Seonghun Park ),김준기 ( Jun-ki Kim ),홍원식 ( Won Sik Hong ) 대한금속재료학회(구 대한금속학회) 2016 대한금속·재료학회지 Vol.54 No.12
The reliability of printed circuit boards (PCB) has emerged as a critical concern as the size of solder bump decreases and current density to solder bump increases by fine pitch formation. The main failure mode of solder bumps is open-circuits due to void formation as intermetallic compounds (IMC) grow, mainly due to electromigration. This study modeled IMC growth by electromigration in Sn-0.7Cu solder bumps. The IMC produced in the reflow process grew again significantly due to electromigration upon application of electric current. The thickness of the IMC under electromigration increased as the current increased from 1 A (current density: 1.3 × 104 A/cm2) to 1.5 A (current density: 1.9 × 104 A/cm2). For the current density applied in the study, IMC growth of Cu6Sn5 was faster than that of Cu3Sn. The Nernst-Einstein relation was used to model the IMC growth induced by electromigration. The modeling results of Cu3Sn and Cu6Sn5 thickness showed good agreement with the experimental observations of IMC growth under electromigration. Specifically, a good prediction for Cu3Sn growth was derived for the current density of 1.3 × 104 A/cm2. However, the modeling values of 1.9 × 104 A/cm2 and Cu6Sn5 thickness showed a minor difference as compared with the experimental IMC thickness results. As the current density increased from 1.3 × 104 A/cm2 to 1.9 × 104 A/cm2, the solder bump probably evolved under heat generation, and the further effects of aging and thermomigration should be incorporated in the IMC growth. †(Received April 7, 2016; Accepted June 17, 2016)
김민형 ( Min-hyeong Kim ),김홍준 ( Hong-jun Kim ),허민혁 ( Min-hyeok Heo ) 한국정보처리학회 2020 한국정보처리학회 학술대회논문집 Vol.27 No.2
예전보다 약과의 접촉이 많아지고 쉬워지면서 집안에 방치되거나 복용을 잊어버린 약들이 더 많아졌다. 이런 약들을 다시 먹으려 할 때는 특별한 주의가 필요하다. 특히나 임산부, 어린이등 취약 계층은 더욱 주의가 필요하다. 이들 모두가 간단하게 이용할 수 있게 사진을 찍으면 약의 이름과 효능, 부작용, 복용방법 등에 대한 정보를 알 수 있는 어플리케이션을 개발했다.