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리튬 니오베이트(LiNbO₃) 웨이퍼의 CMP에 관한 연구
조한철(Hanchul Cho),정석훈(Sukhoon Jeong),이호준(Hojun Lee),박재홍(Jaehong Park),김형재(Hyoungjae Kim),정해도(Haedo Jeong) 한국기계가공학회 2007 한국기계가공학회 춘추계학술대회 논문집 Vol.2007 No.-
Lithium niobate (LiNbO₃) crystal is a kind of brittle and high hardness material. Lithium niobate is ferroelectric that has piezoelectric and pyroelectric characteristic. Because of these characteristics, lithium niobate is used in many electron components and parts. However, it is easily damaged during machining, and difficult to obtain high quality surface. In oder to obtain high MRR (material removal rate) and high quality surface roughness, lithium niobate polishing process applied to CMP (chemical mechanical polishing) process which is consisted of chemical and mechanical effects. In these experiments, two type pads closed-cell type pad (IC 1400 K-groove pad) and opened-cell type pad (Suba 800 M2 pad) and slurry of fumed silica type (ILD 1300 slurry) were used in same velocity and pressure conditions. Nano-view was used to measure surface roughness of the wafer.
김영민(Young-min Kim),조한철(Han-chul Cho),정해도(Haedo Jeong) 대한기계학회 2008 대한기계학회 춘추학술대회 Vol.2008 No.11
Cleaning is required following CMP (chemical mechanical planarization) to remove particles. The minimization of particle residue is required with each successive technology generation, and te cleaning of wafers becomes more complicated. In copper damascene process for interconnection structure, it utilizes 2-step CMP consists of Cu CMP and barrier CMP. Such a 2-steps CMP process leaves a lot of abrasive particles on the wafer surface, cleaning is required to remove abrasive particles. In this study, the buffing is performed various conditions as a cleaning process. The buffing process combined mechanical cleaning by friction between a wafer and a buffing pad and chemical cleaning by buffing solution consists of tetramethyl ammonium hydroxide(TMAH)/benzotriazole(BTA)
구리 CMP 후 연마입자 제거에 화학 기계적 세정의 효과
김영민(Young-min Kim),조한철(Han-chul Cho),정해도(Haedo Jeong) 대한기계학회 2009 大韓機械學會論文集A Vol.33 No.10
Cleaning is required following CMP (chemical mechanical planarization) to remove particles. The minimization of particle residue is required with each successive technology generation, and the cleaning of wafers becomes more complicated. In copper damascene process for interconnection structure, it utilizes 2-step CMP consists of Cu and barrier CMP. Such a 2-steps CMP process leaves a lot of abrasive particles on the wafer surface, cleaning is required to remove abrasive particles. In this study, the chemical mechanical cleaning(CMC) is performed various conditions as a cleaning process. The CMC process combined mechanical cleaning by friction between a wafer and a pad and chemical cleaning by CMC solution consists of tetramethyl ammonium hydroxide (TMAH) / benzotriazole (BTA). This paper studies the removal of abrasive on the Cu wafer and the cleaning efficiency of CMC process.
리튬탄탈레이트(LiTaO₃) 기판의 화학기계적 연마 기술
이현섭(Hyunseop Lee),조한철(Hanchul Cho),정해도(Haedo Jeong) 대한기계학회 2008 대한기계학회 춘추학술대회 Vol.2008 No.5
Recently, lithium tantalate (LiTaO₃, LT) has been widely used for a piezoelectric material for SAW components and optical waveguides because of its piezoelectric, electro-optical, nonlinear optical characteristics, and a wide transparency range from ultraviolet to infrared. LT wafers should be polished to be used for substrates of device and waveguides due to surface scattering. However, few researchers have been reported on the chemical mechanical polishing (CMP) of LT. In this paper, we investigated the characteristics of potassium hydroxide (KOH)-hydrogen peroxide (H₂O₂) based slurry in CMP of LT by using modification of KOH based CMP slurry.
정회룡(Hoeryong Jung),김상준(Sangjoon J. Kim),박정훈(Junghoon Park),조해도(Haedo Cho),안범모(Bummo Ahn),나영진(Youngjin Na),김영진(Yeongjin Kim) 대한기계학회 2018 大韓機械學會論文集A Vol.42 No.10
최소 침습 수술(minimally invasive surgery, MIS)에서 수술 도구의 유연성과 조작 용이성은 매우 중요한 요소이다. 유연 수술 로봇은 유연한 동작이 가능하고 조작이 용이하여 기존 복강경 수술로봇 대비 향상된 수술결과를 기대할 수 있어 기존 수술로봇의 한계를 극복할 수 있는 진보된 수술로봇으로 주목을 받고 있다. 본 논문에서는 메소-스케일(meso-scale)의 최신 유연 수술 로봇을 소개하고, 유연 수술 로봇의 디자인 및 한계점을 분석하고자 한다. 연 조직(soft tissue)을 대상으로 개발된 다양한 최신의 유연수술 로봇들을 소개하고 유연 수술 로봇의 한계점을 극복하기 위한 영상 유도 기법, 관절의 강성 조절기법, 로봇의 재질 등에 대한 최신의 연구동향을 살펴본다. 현재 유연 수술 로봇의 기술적 한계점을 분석하고 향후 연구개발 방향을 제시한다. A soft surgical robot in a minimally invasive surgery offers flexibility and ease of operation. The robot can be used to easily access the lesion and perform surgical processes even in a narrow space within the abdominal cavity during surgery. This review paper introduces the latest meso-scale soft surgical robots and describes their design and limitations. This paper discusses various surgical robots used in various medical fields targeting soft tissues only. Image guidance techniques, stiffness modulation control of the soft joints, and materials of the robot body to overcome limitations of the existing soft surgical robots are a main focus of this review.