http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
적층 세라믹 캐피시터의 2차 소성을 위한 칩 정렬 자동화 시스템 개발
신오철(O-Chol Shin),정수룡(Soo-Ryong Jung),김성일(Seong-Il Kim),정원지(Won-Ji Chung),정순현(Sun-Hyeon Jung),김재민(Jae-Min Kim) 한국기계가공학회 2009 한국기계가공학회 춘추계학술대회 논문집 Vol.2009 No.6월
Production processes of MLCC is required for array mixed cut chip and powder on the plate to second firing after first firing and cutting. An existing production processes is a hand array. therefore an existing production processes had lower production efficiency and higher faulty product. but developed array Automation system could have apply one or more model and one or more part of cut chip array on the plate as a result of this research. Also density of cut chip is higher than 95% as compared with an existing production processes. as well as reduction of working hours by with out vertical arrangement and lamination. While array prepossessing, scattering of chip and breakage of plate could not occur.
적층 세라믹 캐피시터의 2차 소성을 위한 칩 정렬 자동화 시스템 개발
신오철(O-Chol Shin),정수룡(Soo-Ryong Jung),김성일(Seong-Il Kim),정원지(Won-Ji Chung),정순현(Sun-Hyeon Jung),김재민(Jae-Min Kim) 한국기계가공학회 2009 한국기계가공학회 춘추계학술대회 논문집 Vol.2009 No.6
Production processes of MLCC is required for array mixed cut chip and powder on the plate to second firing after first firing and cutting. An existing production processes is a hand array. therefore an existing production processes had lower production efficiency and higher faulty product. but developed array Automation system could have apply one or more model and one or more part of cut chip array on the plate as a result of this research. Also density of cut chip is higher than 95% as compared with an existing production processes. as well as reduction of working hours by with out vertical arrangement and lamination. While array prepossessing, scattering of chip and breakage of plate could not occur.
MLCC의 2차 소성을 위한 칩 정렬 자동화 시스템 제작 및 기초 성능평가
신오철(O-Chol Shin),정수용(Soo-ryong Jung),정원지(Won-ji Chung),정순현(Sun-hyeon Jung),김재민(Jae-min Kim) 한국생산제조학회 2009 한국공작기계학회 추계학술대회논문집 Vol.2009 No.-
MLCC production process is after the first plasticity and 2nd cutting plasticity for mix to plastic chips and powder. And should be constant alignment in the plaid. However, the existing manual tasks in the most efficient product defects were falling. However, this research project was developed through an automated system for sorting on a single system model, one or more of the model can be applied to multi structure and alignment of one plate divided into one or more advantages can be sorted by and compared to existing manual or system-chip alignment and density of 95% or more chips stacked vertically placed, and the symptoms can be reduced, and sorting operations that occur on scattering of chips, broken plates the benefits do not occur.
MLCC의 2차 소성을 위한 칩 정렬 자동화 시스템 제작 및 기초 성능평가
신오철(O-Chol Shin),정수용(Soo-ryong Jung),정원지(Won-ji Chung),정순현(Sun-hyeon Jung),김재민(Jae-min Kim) 한국생산제조학회 2009 한국생산제조시스템학회 학술발표대회 논문집 Vol.2009 No.10
MLCC production process is after the first plasticity and 2nd cutting plasticity for mix to plastic chips and powder. And should be constant alignment in the plaid. However, the existing manual tasks in the most efficient product defects were falling. However, this research project was developed through an automated system for sorting on a single system model, one or more of the model can be applied to multi structure and alignment of one plate divided into one or more advantages can be sorted by and compared to existing manual or system-chip alignment and density of 95% or more chips stacked vertically placed, and the symptoms can be reduced, and sorting operations that occur on scattering of chips, broken plates the benefits do not occur.