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목질바닥재 적용을 위한 Microencapsulated PCM의 성능평가
정수광(Jeong Su-Gwnag),전지수(Jeon Jisoo),서정기(Seo Junki),신유정(Shin You Jung),김수민(Kim Sumin) 한국건축친환경설비학회 2011 한국건축친환경설비학회 학술발표대회 논문집 Vol.2011 No.10
Thermal energy storage systems using Microencapsulated phase change material (MPCM) have been recognized as one of the most advanced energy technologies in enhancing the energy efficiency and sustainability of buildings. We studied to incorporate MPCMs with building materials through application for adhesive of wood-based flooring. Wood-based flooring is common used for floor finish materials of residential building in Korea. This study is aimed at making high thermal efficiency wood-based flooring by increasing its heat storage using MPCM which has 27-31℃ phase change temperature range. To increasing the heat storage of wood-based flooring, MPCM was used with adhesive for surface bonding of wood-based flooring. MPCM of 3, 6, 7, 10wt% was added to adhesive which was made by the 1:1 ratio mixed epoxy resin consist base with hardener. MPCM/adhesive composite were prepared by the stirring of MPCM in liquid state adhesive. As a result, scanning electron microscopy (SEM) morphology showed uniform dispersion of MPCM in the adhesive. This MPCM/adhesive composite has the characteristic of heat storage by analyzing differential scanning calorimetry (DSC) measurement. And we analyzed this composition was formed by physical combination through the Fourier transform infrared (FT-IR).
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