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반도체 본딩 불량 검출을 위한 U-Net 기반 X선 영상 배경 제거
임선호(Sunho Lim),조승룡(Seungryong Cho),이태원(Taewon Lee) 대한전자공학회 2022 대한전자공학회 학술대회 Vol.2022 No.11
Semiconductor packaging technology has been developing in response to the demand for high performance and miniaturization of electronic products. X-rays are inevitably used to detect defects due to bonding methods using wires and bumps used in highly integrated semiconductor chips. However, in the case of an inspection method using a computed tomography (CT) scan, productivity is lowered due to a long imaging time, and more defects are caused due to an increase in the dose to the semiconductor chip. To solve this problem, in this paper, we proposed a preprocessing method that uses U-Net to remove the background information, not the part to be inspected, from the 2D X-ray image of the semiconductor chip, and it was confirmed that the background was successfully removed.