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신종명(Jong-Myung Shin),우선보(Sun-Bo Woo),손영갑(Young-Kap Son),장석원(Seog-Weon Chang),신승중(Seung-Jung Shin),곽계달(Kae-Dal Kwack) 대한기계학회 2007 대한기계학회 춘추학술대회 Vol.2007 No.10
This study explains and predicts B₁? life by using ALT(Accelerated Life Test) for a multi-chip Bluetooth module which is becoming one of the most important component in electric appliances. The failure mode/mechanism of Bluetooth module can be classified into three groups but this paper mostly focuses on the dominant failure mode/mechanism which is open due to cracks and delaminations inside the module. This failure mode/mechanism is tested by using thermal shock as a stress. Through this study, we have estimated that B₁? life of the multi-chip Bluetooth module is l495cycles when ΔT is 125℃.