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이충석(Choong-Seok Lee),채승수(Seung-Su Chae),박세진(Se-Jin Park),김종표(Jong-Pyo Kim),오중표(Joong-Pyo Oh),이종찬(Jong-Chan Lee) 한국기계가공학회 2006 한국기계가공학회 춘추계학술대회 논문집 Vol.2006 No.-
This study reports the grinding characteristics of silicon carbide (SiC) using diamond grinding wheel. Grinding experiments were performed at various grinding conditions including grinding directions(up grinding, down grinding), table speeds and depth of cuts. The grinding forces at various table speed and depth of cut were measured under fixed material removal rate. The surface roughnesses at various table speed and depth of cut were obtained. The experimental results show that the grinding forces were lower at the higher table speed and lower depth of cut under same material removal rate. The surface roughnesses were worse at the higher table speed, but it was not related with depth of cut.
Resin-Bonded Diamond Wheel의 기공 유ㆍ무에 따른 연삭저항력 평가에 관한 연구
이상민(Sang-Min Lee),채승수(Seung-Su Chae),이충석(Choong-Seok Lee),김택수(Taeck-Su Kim),이종찬(Jong-Chan Lee),오중표(Joong-Pyo Oh) 한국기계가공학회 2007 한국기계가공학회 춘추계학술대회 논문집 Vol.2007 No.-
The resin bonded diamond wheel is used to grind the difficult-to-cut materials. Traditionally, the resin bonded diamond wheel is manufactured without any pores due to the characteristics of resin bond. In this study, two porous resin bonded diamond wheel were made and the grinding characteristics were compared with traditional nonporous ones. The experimental results indicate that the porous resin bond diamond wheel require less grinding forces and powers.