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피부에 의한 이득 감쇠를 줄이기 위한 FEA 시뮬레이션 기반의 이식형 마이크로폰 설계 및 구현
한지훈,김민우,김동욱,성기웅,조성목,박일용,조진호,Han, Ji-Hun,Kim, Min-Woo,Kim, Dong-Wook,Seong, Ki-Woong,Cho, Sung-Mok,Park, Il-Yong,Cho, Jin-Ho 대한의용생체공학회 2008 의공학회지 Vol.29 No.1
Nowadays, implantable hearing aids have been developed to solve the problems of conventional hearing aids. In case of fully implantable hearing aids, an implantable microphone is necessary to receive sound signal beneath the skin. Normally, an implantable microphone has poor frequency response characteristics in high frequency bands of acoustic signal due to the high frequency attenuation effect of skin after implantation to human body. In this paper, the implantable microphone is designed to reduce the high frequency attenuation effect of a skin by putting its resonance frequency at the attenuated range through a finite element analysis (FEA) simulation. The designed implantable microphone through the simulated results has been fabricated by manufacturing process using bio-compatible materials. By the several in-vitro experiments with pig skin, it has been verified that the designed implantable microphone has a resonance frequency around the starting part of the attenuated range and reduces the attenuation effect.
차세대 반도체용 구리 배선의 응력과 응력 유발 파손에 관한 연구
백종민 ( Jong Min Paik ),박일목 ( Il Mok Park ),주영창 ( Young Chang Joo ) 대한금속재료학회 ( 구 대한금속학회 ) 2005 ELECTRONIC MATERIALS LETTERS Vol.1 No.1
Damascene Cu interconnects show significant differences in both microstructural and stress behavior compared to those of the Al interconnects patterned using the etching process. Thermal stresses build up during the successive thermal cycles due to the differences in the coefficients of thermal expansion (CTE`s) of the component materials. Other than thermal stresses, growth stresses that are originated from grain growth develop in damascene Cu interconnects as well. In this study, the line width dependence of stress in damascene Cu was examined experimentally as well as with a numerical simulation. The stresses of damascene Cu with a width ranging from 0.13 to 2 ㎛ were measured using x-ray diffraction. The measured hydrostatic stress was found to increase with increasing line width, which was not common tendency for Al interconnects. Microstructure analysis using TEM revealed that the grain sizes increased with increasing line dimensions. The larger stress in the interconnect with large dimension is attributed to the larger grain size, which induce higher growth stress in addition to thermal stress. The contribution of the growth and thermal stress of the damascene lines were quantified based on the grain size data utilizing finite element analysis. By this calculation, the line width dependence of hydrostatic stress of damascene Cu was clearly explained. Finally, the effect of growth stress on stress-related reliability is discussed.