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소형 전자 기기의 열설계를 위한 복합층 방열시트의 등가 열물성 측정법
이요셉(J.S. Lee),박경의(K.U. Park),김동현(D.H. Kim),임영태(Y.T. Im),김인중(I.J. Kim),안원기(W.K. Ahn),김민수(M.S. Kim),홍석호(S.H. Hong) 대한기계학회 2012 대한기계학회 춘추학술대회 Vol.2012 No.11
Portable electronic devices generate heat more and more because of high power and thinner design specifications. The excessive heat makes the devices operate not properly and makes customers feel uncomfortable. To dissipate such excessive heat, various multi-layer heat spreading sheets (HSS) are attached to the various components of electronic devices. This study is conducted for the optimized thermal design of portable devices in the aspect of an analytical simulation modeling of HSS. First of all, test module which is similar to the product was employed and the test was done following the Graphite sheet. This result is used as input data for the computer simulation to calculate the equivalent thermal properties. Then the analytical result is compared and verified with theoretical thermal properties. Finally, thermal properties which can be applied to the concept design stage have been proposed.