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유성열(Seong-Ryoul Ryoo),목진성(Chin-Sung Mock),조태식(Tae-Sik Cho),김철주(Chul-Ju Kim) 한국철도학회 2011 한국철도학회 학술발표대회논문집 Vol.2011 No.10
The present study deals with the results of a thermo-fluid analysis applied to the cooling plate of the water cooling system developed for IGBT stacks which was designed to keep the power semi-conductors from over heating problems. The cooling plate is to absorb a maximum quantity of 10kW from 4 IGBTs which are to be placed on both sides of the cooling plate 2 IGBTs of them on each surface. For the analysis Adina of CFD Program was used and an analysis was conducted to obtain the knowledges on heat and mass flow at both the plate and fluid flow inside. For the simulation the operational conditions of a temperature difference of 15℃ for the working fluid and a uniform heat flux of about 92000 W/m2 on the surface in contact with an IGBTs.