http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
Alteration in Biomechanical Characterization of Blood Vessels and Bones in Type 2 Diabetic Mice
J. Kim(김정실),M.-K. Lee(이미경) Korean Society for Precision Engineering 2021 한국정밀공학회 학술발표대회 논문집 Vol.2021 No.11월
Type 2 diabetes is a lifelong disease with impaired glucose regulation. It is the most common type of diabetes and is linked to an increased prevalence of cardiovascular complications and bone remodeling. Metformin is a typical medicine used to treat type 2 diabetes. To better understand the changes in mechanics of the artery and bone caused by type 2 diabetes, we used three groups of 13-week-old male mice (m+/db mice as control, untreated db/db mice, and db/db mice with metformin treatment for 6 weeks). Isolated aortas and common carotid arteries were used for passive mechanical testing, and isolated femurs were used for 3-point bend testing. During the extension-inflation test, the outer diameter of metformin treated db/db aorta is greater than other aortas. Interestingly, metformin treatment results in a less increase in outer diameter and circumferential stretch compared to untreated db/db carotid, as the lumen pressure increases. The ultimate force of the femur is significantly greater in the control compared to others. This study elucidates that the remodeling of artery and bone in type 2 diabetic mice, and that metformin treatment alters the arterial mechanics in unique ways depending on the arterial location.
이승우(S. W. Lee),한승우(S. W. Han),김정실(J. S. Kim),송준엽(J. Y. Song),김완두(W. D. Kim) 대한기계학회 2005 대한기계학회 춘추학술대회 Vol.2005 No.5
The reliability evaluation and analysis for general electronic components are required to guarantee in quality and in efficiency. Reliability prediction of the interface card, which is used in the CNC controller of machine tools, was carried out using MIL-HDBK-217F and PRISM database. Reliability performances such as MTBF(Mean Time Between Failure), failure rate and reliability were obtained, and the variation of failure rate for electronic components according to temperature change was predicted. The results obtained from this study are useful information to consider a counter plan for the weak components before they are used.