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강건하고 정확한 방사기저함수를 위한 정규화 파라미터의 최적화
김원해(Wonhae Kim),박도현(Dohyun Park),최동훈(Dong-Hoon Choi) 대한기계학회 2012 대한기계학회 춘추학술대회 Vol.2012 No.11
This study aims to optimization of regularization parameter in radial basis function to construct robust and accurate meta-model. Regularization parameter is one of the factors that affect accuracy of a radial basis function. The selection of appropriate regularization parameter can improve accuracy of radial basis function. However it is hard to know appropriate regularization parameter in advance because it depends on the problem. In this study, we suggest construction of robust and accurate meta-model by finding the optimal regularization parameter which minimized generalized cross-validation error expressed as a closed form solution.
김승빈(Seungbin Kim),신지혁(Jihyeok Shin),강지훈(Jihoon Kang),김원해(Wonhae Kim),이용석(Yong-Seok Lee) 대한기계학회 2023 대한기계학회 춘추학술대회 Vol.2023 No.11
Creep behavior of solder ball in electronic packaging is one of the main concerns. Solder alloy can reach 50% of its melting point easily when application is operated. As a result, manufacturers should consider solder creep because creep behavior is dominant over 0.4Tm of solder alloy. In this research, we made quarter model of ball-grid-array electronic package through finite element analysis. Simulation cases consisted of 9 cases according to solder ball position arrangement, and creep analysis was performed with a cycle of thermal profile -45℃ ~125℃. Therefore, we suggested which case is the optimum arrangement for creep fatigue life and mechanical reliability of ball-grid-array packaging.