http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
구석본(Seok-Bon Koo),전준미(Jun-Mi Jeon),이창면(Chang-Myeon Lee),허진영(Jin-Young Hur),이홍기(Hong-Kee Lee) 한국표면공학회 2018 한국표면공학회지 Vol.51 No.4
The self-annealing which leads evolution of microstructure in copper electroplating layers at room temperature occurs after forming deposition layer. During the process, crystal orientation, size and sheet resistance of plating layer change. Lastly, it causes the change of physical and mechanical characteristics such as a tensile strength of plating layer. In this study, the variation of incorporated impurities, microstructure and sheet resistance of copper plating layer formed by electroplating are measured with and without inorganic additives during the self-annealing. In case of absence of inorganic additives, the copper layer presents strong total intensity of incorporated impurities. During the self-annealing, such width of reduction was significant. Moreover, microstructure and crystal size are increased while the tensile strength is decreased noticeably. On the other hand, in the presence of inorganic additives, there is no observable distinction in the copper plating layer. According to the observation on movements of the incorporated impurities in electrodeposition copper layer, within 12 hours the impurities are continuously shifted from inside of the plating layer to its surface after as-deposited electroplating. Within 24 hours, except for the small portion of surface layer, it is considered that most of the microstructure is transformed.
이홍기(Hong-Kee Lee),손성호(Seong-Ho Son),이호영(Ho-Young Lee),구석본(Seok-Bon Koo),전준미(Jun-Mi Jeon) 한국표면공학회 2006 한국표면공학회지 Vol.39 No.4
Ni-SiC composite coating layers were prepared by electroplating method and their deposition rate, codepo-sition of SiC, morphology, surface roughness, hardness, wear and friction properties were investigated. It was found that the deposition rate and the codeposition of SiC in the composite coating layer increased with increasing concentration of SiC in the solution only at the early stage. Both of them reached certain maxima and then decreased with increasing concentration of SiC. Rough surface was obtained with increasing codeposition of SiC, which is probably due to the agglomeration of the SiC particle in the vicinity of surface. Vickers hardness increased with increasing codeposition of SiC and heat treatment at 300℃ in air for 1 hour. Wear volume decreased with increasing codeposition of SiC and friction coefficient increased with increasing codeposition of SiC at the early stage, and it became almost constant. Such wear and friction behaviors are desirable for the practical application.
미세피치 플립칩 패키지 구현을 위한 EPIG 표면처리에서의 무전해 팔라듐 피막특성 및 확산에 관한 연구
허진영(Jin-Young Hur),이창면(Chang-Myeon Lee),구석본(Seok-Bon Koo),전준미(Jun-Mi Jeon),이홍기(Hong-Kee Lee) 한국표면공학회 2017 한국표면공학회지 Vol.50 No.3
EPIG (Electroless Pd/immersion Au) process was studied to replace ENIG (electroless Ni/immersion Au) and ENEPIG (electroless Ni/electroless Pd/immersion Au) processes for bump surface treatment used in high reliable flip chip packages. The palladium and gold layers formed by EPIG process were uniform with thickness of 125 nm and 34.5 nm, respectively. EPAG (Electroless Pd/autocatalytic Au) also produced even layers of palladium and gold with the thickness of 115 nm and 100 nm. TEM results exhibited that the gold layer in EPIG surface had crystalline structure while the palladium layer was amorphous one. After annealing at 250 nm, XPS analysis indicated that the palladium layer with thickness more than 22~33 nm could act as a diffusion barrier of copper interconnects. As a result of comparing the chip shear strength obtained from ENIG and EPIG surfaces, it was confirmed that the bonding strength was similar each other as 12.337 kg and 12.330 kg, respectively.