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Shear Strength of Copper Joints Prepared by Low Temperature Sintering of Silver Nanoparticles
Zbyněk Pešina,Vít Vykoukal,Marián Palcut,Jiří Sopoušek 대한금속·재료학회 2014 ELECTRONIC MATERIALS LETTERS Vol.10 No.1
In this work, mechanical properties of Cu-to-Cu joint samples prepared by low temperature sintering of Ag nanoparticle paste have been investigated. The silver nanopaste was prepared by a controlled thermal decomposition of an organometallic precursor. The as-synthesized Ag particles were spherical, with an average diameter of 8.5 nm. The Cu-to-Cu joint samples were made by placing a small amount of Ag nanopaste between two polished Cu plates and sintering at 150°C, 200°C, 220°C and 350°C in air. A normal load was applied to aid sintering. Mechanical properties were measured by imposing a uniform stress across the sample bond area and measuring the corresponding strain. The application of external load was found to have a positive effect on the material’s mechanical properties. Furthermore, interestingly high values of shear strength were observed.