RISS 학술연구정보서비스

검색
다국어 입력

http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.

변환된 중국어를 복사하여 사용하시면 됩니다.

예시)
  • 中文 을 입력하시려면 zhongwen을 입력하시고 space를누르시면됩니다.
  • 北京 을 입력하시려면 beijing을 입력하시고 space를 누르시면 됩니다.
닫기
    인기검색어 순위 펼치기

    RISS 인기검색어

      검색결과 좁혀 보기

      선택해제

      오늘 본 자료

      • 오늘 본 자료가 없습니다.
      더보기
      • 무료
      • 기관 내 무료
      • 유료
      • KCI등재

        A Comparative Study on Electrical Characteristics of Crystalline AlN Thin Films Deposited by ICP and HCPA-Sourced Atomic Layer Deposition

        Halit Altuntas,Turkan Bayrak 대한금속·재료학회 2017 ELECTRONIC MATERIALS LETTERS Vol.13 No.2

        In this work, we aimed to investigate the effects of two different plasma sourceson the electrical properties of low-temperature plasma-assisted atomic layerdeposited (PA-ALD) AlN thin films. To compare the electrical properties,50 nm thick AlN films were grown on p-type Si substrates at 200 °C by usingan inductively coupled RF-plasma (ICP) and a stainless steel hollowcathode plasma-assisted (HCPA) ALD systems. Al/AlN/p-Si metal-insulatorsemiconductor(MIS) capacitor devices were fabricated and capacitance versusvoltage (C-V) and current-voltage (I-V) measurements performed to assess thebasic important electrical parameters such as dielectric constant, effectivecharge density, flat-band voltage, breakdown field, and threshold voltage. Inaddition, structural properties of the films were presented and compared. Theresults show that although HCPA-ALD deposited AlN thin films hasstructurally better and has a lower effective charge density (Neff) value thanICP-ALD deposited AlN films, those films have large leakage current, lowdielectric constant, and low breakdown field. This situation was attributed tothe involvement of Si atoms into the AlN layers during the HCPA-ALDprocessing leads to additional current path at AlN/Si interface and might impairthe electrical properties. PACS: 73.30.+y: 73.40.Qv: 73.40.Ns

      연관 검색어 추천

      이 검색어로 많이 본 자료

      활용도 높은 자료

      해외이동버튼