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RISS 인기검색어
- 검색키워드
- 저자 : Di Erick Xu (검색결과 2 건)
- 무료
- 기관 내 무료
- 유료
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Sn-Ag-Cu to Cu Joint Current Aging Test and Evolution of Resistance and Microstructure
Di Erick Xu,Jasper Chow,Michael Mayer,정재필,윤종현 대한금속·재료학회 2015 ELECTRONIC MATERIALS LETTERS Vol.11 No.6
SAC 305 solder bump with 800 μm diameter were produced and soldered to a custom substrate with Cu lines as leads that allow for resistance measurement during current aging. The measured joint resistance values (leads plus solder bump) before aging are 7.7 ± 1.8 mΩ and 11.8 ± 2.8 mΩ at room temperature and 160°C, respectively. In general, the resistance of the solder joint increases instantly by about 1 mΩ, when subjected to a 2.2 A aging current at 160°C. The increase is gradual in the following hours of aging and more drastic as it approaches the final failure. Four stages are identified in the resistance signal curve and compared with observations from cross sections. The stages are IMC growth, crack formation and propagation, intermittent crack healing-forming, and final failure resulting in an open connection at the cathode. Recently a periodical drop and rise behavior was reported for the resistance signal. This behavior is reproduced and attributed to the intermittent crack healing-forming stage. The healing events observed are faster than the sampling time. Possibly, as current is concentrated when bypassing interfacial cracks, local melting occurs partially filling cracks before resolidifying.
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Electromigration of Composite Sn-Ag-Cu Solder Bumps
Ashutosh Sharma,Di Erick Xu,Jasper Chow,Michael Mayer,Heung-Rak Sohn,정재필 대한금속·재료학회 2015 ELECTRONIC MATERIALS LETTERS Vol.11 No.6
This study investigates the electromigration (EM) behavior of lead free Sn- Ag-Cu (SAC) solder alloys that were reinforced with different types of nanoparticles [Copper-coated carbon nanotubes (Cu/CNT), La2O3, Graphene, SiC, and ZrO2]. The composite solders were bumped on a Cu substrate at 220°C, and the resistance of the bumped solders was measured using a four wire setup. Current aging was carried out for 4 hours at a temperature of 160°C, and an increase in resistance was noted during this time. Of all the composite solders that were studied, La2O3 and SiC reinforced SAC solders exhibited the smallest resistances after current aging. However, the rate of change in the resistance at room temperature was lower for the SiC-reinforced SAC solder. The SAC and Graphene reinforced SAC solder bumps completely failed within 15 - 20 min of these tests. The SiC nanoparticles were reported to possibly entrap the SAC atoms better than other nanoparticles with a lower rate of EM.
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