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        Temperature nonuniformity management in heat sinks through applying counterflow design complex minichannels

        Morteza Khoshvaght-Aliabadi,Amir Feizabadi,Aida Salimi,Mohammad Mehdi Rashidi 한국화학공학회 2022 Korean Journal of Chemical Engineering Vol.39 No.6

        Thanks to the electronic industrial revolution, miniaturization, which is a trend to manufacture smallerproducts and devices, has been extended to hardware components. In these devices, the heat flux magnitude increasesdue to the smaller surface area. Therefore, heat dissipation and temperature uniformity are crucial issues that must bemanaged precisely, otherwise destructive effects on system performance and device lifespan are unavoidable. Heat sinksare efficient equipment utilized to solve these dire consequences. In this study, to improve the temperature uniformityof electronic components, novel minichannels, including straight walls with wavy fins (SWS) and wavy walls withstraight fins (WSW), were examined with counter-flow patterns. The observations imply that these novel minichannelsbring 18.1-40.3% decrease of the base temperature under the heat flux of 100 kW m2. It is also revealed that using thenovel minichannels can increase the temperature uniformity up to 93.1%. In addition, overall hydrothermal performancecan be enhanced as high as 1.64 under the pumping power of 0.0374W. It was also found that the use of WSWmodels leads to lower magnitudes of pumping power compared to SWS models. It is concluded that applying the proposedminichannels could be an efficient approach to manage temperature non-uniformity in heat sinks.

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