http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
급속소결 방법을 이용한 마찰교반 접합 툴용 WC-Co 소결체 제조 및 특성 평가
박현국,윤희준,유정한,장준호,손인진,오익현,Park, Hyun-Kuk,Youn, Hee-Jun,Ryu, Jung-Han,Jang, Jun-Ho,Shon, In-Jin,Oh, Ik-Hyun 대한용접접합학회 2012 대한용접·접합학회지 Vol.30 No.6
Using the pulsed current activated sintering method, the WC-10wt.% Co materials were densified using a WC and Co powder. The WC-Co almost completely dense with a relative density of up to 99.5 % after the simultaneous application of a pressure of 60 MPa and an electric current for 3 minutes almost without any significant change in the grain size. The average grain size of about $0.3{\mu}m$. The hardness and fracture toughness at $1000^{\circ}C$ were about $2200kg/mm^2$ and $9.8MPa.m^{1/2}$, respectively.
탄소 나노튜브 함유량이 Solderable 등방성 및 이방성 도전성 접착제의 접합 특성 변화에 미치는 영향
임병승(Byung-Seung Yim),윤희준(Hee Jun Youn),이정일(Jeong Il Lee),김종민(Jong-Min Kim) 대한용접·접합학회 2020 대한용접·접합학회지 Vol.38 No.2
In this paper, two types of multi-walled carbon nanotube (MWCNT)-filled solderable electrically conductive adhesive (SECA) systems were formulated, a solderable isotropic conductive adhesive (SICA) containing 40 vol% of low melting point alloy (LMPA), and a solderable anisotropic conductive adhesive (SACA) with 20 vol% of LMPA, with different MWCNT contents (0, 0.03, 0.5 and 2 wt%). A quad flat package (QFP) interconnection test was conducted for each SECA system to investigate the influence of the MWCNT concentration on the interconnection properties of the SICA and SACA systems. The results indicated that the interconnection properties (i.e., electrical and mechanical properties) of each SECA were enhanced at low MWCNT concentration, due to the reinforcing effects of the MWCNT. However, the interconnection properties of each SECA joint deteriorated with increasing MWCNT concentration over 0.5 wt% because of defects in the conduction path, such as entrapped MWCNT-filled polymer (SICA), or reduction of the conduction path area (SACA) due to increased polymer viscosity and diminished molten LMPA mobility.
방전플라즈마 소결 공정을 이용한 스퍼터링 타겟용 타이타늄 소결체 제조 및 특성 평가
이승민 ( Seung Min Lee ),박현국 ( Hyun Kuk Park ),윤희준 ( Hee Jun Youn ),양준모 ( Jun Mo Yang ),우기도 ( Kee Do Woo ),오익현 ( Ik Hyun Oh ) 대한금속재료학회(구 대한금속학회) 2011 대한금속·재료학회지 Vol.49 No.11
The Spark Plasma Sintering(SPS) method offers a means of fabricating a sintered-body having high density without grain growth through short sintering time and a one-step process. A titanium compact having high density and purity was fabricated by the SPS process. It can be used to fabricate a Ti sputtering target with controlled parameters such as sintering temperature, heating rate, and pressure to establish the optimized processingconditions. The compact/target(?) has a diameter of Φ150×6.35 mm. The density, purity, phase transformation, and microstructure of the Ti compact were analyzed by Archimedes, ICP, XRD and FESEM. A Ti thin-film fabricated on a Si/SiO2 substrate by a sputtering device (SRN-100) was analyzed by XRD, TEM, and SIMS. Density and grain size were up to 99% and below 40 ?m, respectively. The specific resistivity of the optimized Ti target was 8.63×10-6 Ω·cm.
방전플라즈마 소결 공정을 이용한 WC-6wt.%Co 소결체 제조 및 기계적 특성 평가
박국현 ( Hyun Kuk Park ),이승민 ( Seung Min Lee ),윤희준 ( Hee Jun Youn ),방기상 ( Ki Sang Bang ),오익현 ( Ik Hyun Oh ) 대한금속재료학회(구 대한금속학회) 2011 대한금속·재료학회지 Vol.49 No.1
Using the spark plasma sintering process (SPS process), the WC-6wt.%Co hard materials were densified using an ultra fine WC-Co powder. The WC-Co was almost completely dense with a relative density of up to 100% after the simultaneous application of a pressure of 60 MPa and the DC pulse current for 3 min without any significant change in the grain size. The average grain size of WC that was produced through this experiment was about 0.2~0.8 μm. The hardness and fracture toughness were about 1816 kg/mm2 and 15.1 MPa·m1/2, respectively, for 60 MPa at 1200℃.