플립칩 본딩용 접착제 특성에 미치는 촉매제의 영향

민경은,이준식,유세훈,김목순,김준기,Min, Kyung-Eun,Lee, Jun-Sik,Yoo, Se-Hoon,Kim, Mok-Soon,Kim, Jun-Ki 한국재료학회 2010 한국재료학회지 Vol.20 No.12

The application of flip chip technology has been growing with the trend of miniaturization of electronic packages, especially in mobile electronics. Currently, several types of adhesive are used for flip chip bonding and these adhesives require some special properties; they must be solvent-free and fast curing and must ensure joint reliability against thermal fatigue and humidity. In this study, imidazole and its derivatives were added as curing catalysts to epoxy resin and their effects on the adhesive properties were investigated. Non-isothermal DSC analyses showed that the curing temperatures and the heat of reaction were dependent primarily on the type of catalyst. Isothermal dielectric analyses showed that the curing time was dependent on the amount of catalysts added as well as their type. The die shear strength increased with the increase of catalyst content while the Tg decreased. From this study, imidazole catalysts with low molecular weight are expected to be beneficial for snap curing and high adhesion strength for flip chip bonding applications.

Cu-Cu 접착부의 고온고습 내구성에 미치는 경화제 및 촉매제의 영향

민경은,김해연,방정환,김종훈,김준기,Min, Kyung-Eun,Kim, Hae-Yeon,Bang, Jung-Hwan,Kim, Jong-Hoon,Kim, Jun-Ki 한국재료학회 2011 한국재료학회지 Vol.21 No.5

As the performance of microelectronic devices is improved, the use of copper as a heat dissipation member is increasing due to its good thermal conductivity. The high thermal conductivity of copper, however, leads to difficulties in the joining process. Satisfactory bonding with copper is known to be difficult, especially if high shear and peel strengths are desired. The primary reason is that a copper oxide layer develops rapidly and is weakly attached to the base metal under typical conditions. Thus, when a clean copper substrate is bonded, the initial strength of the joint is high, but upon environmental exposure, an oxide layer may develop, which will reduce the durability of the joint. In this study, an epoxy adhesive formulation was investigated to improve the strength and reliability of a copper to copper joint. Epoxy hardeners such as anhydride, dihydrazide, and dicyandiamide and catalysts such as triphenylphosphine and imidazole were added to an epoxy resin mixture of DGEBA and DGEBF. Differential scanning calorimetry (DSC) analyses revealed that the curing temperatures were dependent on the type of hardener rather than on the catalyst, and higher heat of curing resulted in a higher Tg. The reliability of the copper joint against a high temperature and high humidity environment was found to be the lowest in the case of dihydrazide addition. This is attributed to its high water permeability, which led to the formation of a weak boundary layer of copper oxide. It was also found that dicyandiamide provided the highest initial joint strength and reliability while anhydride yielded intermediate performance between dicyandiamide and dihydrazide.

Nylon 66/Cloisite 93A 나노복합체의 기계적 성질에 대한 Nylon 66 점도 효과

민경은(Kyung Eun Min),박상철(Sang Cheol Park),김호겸(Ho Gyum Kim) 한국고분자학회 2013 폴리머 Vol.37 No.1

현재 일반화되어 있는 pilot scale의 복합체 생산설비에서 용융 삽입법으로 nylon 66/Cloisite 93A 나노복합체 의 상용화 가능성을 확인하였으며, nylon 66에 Cloisite 93A 도입으로 인장 및 굴곡응력에 대한 강도와 탄성률이 향 상되었고, 형태학적 및 결정화 거동의 분석을 통해 Cloisite 93A 함량, nylon 66 점도 및 그에 따른 결정화 거동이 주요 영향요소임을 확인하였다. It is found that the commercialization of nylon 66/Cloisite 93A nanocomposite by applying melt intercalation is possible in the composite production facilities of the pilot scale which has been generalized today. The strength and modulus under tensile and flexural stress have been improved with the introduction of Cloisite 93A in nylon 66. Furthermore, it is found through the analysis of morphologic and crystallization behavior that the elements such as content of Cloisite 93A, viscosity of nylon 66 and the crystallization behavior have significantly influences on the characteristics of nanocomposite.

무용치료 사례연구

민경은(Kyung Eun Min),조미혜(Mi Hye Cho) 한국여성체육학회 2008 한국여성체육학회지 Vol.22 No.3

MMT 첨가에 따른 Polyamide/MMT 나노복합체의 흡습 특성

민경은(Kyung Eun Min),박상철(Sang Cheol Park),김호겸(Ho Gyum Kim) 한국고분자학회 2013 폴리머 Vol.37 No.1

Pilot scale에서의 나노복합체의 상용화를 위해 용융 삽입법을 적용하고 이축 압출기로 제조한 polyamide/MMT 나노복합체의 흡습 특성을 연구한 결과, MMT 도입으로 수분 흡수율이 감소되었으며 그에 따라 치수 안정성이 향 상되었다. 굴곡강도 및 탄성률은 수분 흡수율이 증가함에 따라 저하되었으며, 이로부터 MMT의 도입은 강도 향상 효과와 함께 흡습방지를 통한 강도 저하 억제효과도 보이는 것으로 조사되었다. The melt intercalation to commercialize nanocomposites in a pilot scale was applied and the water absorption characteristics for polyamide/MMT nanocomposites manufactured by twin screw extruder was studied. As a result, water absorption decreased with the introduction of MMT and dimensional stability was improved. However, as water absorption increased, flexural strength and modulus were reduced. Therefore, the effect of MMT introduction on mechanical properties of nanocomposites was clearly observed, which may increase the level of strength by maintaining anti-water absorption property of nanocomposite.

‘가족이라는 환상’의 계승자 노리코

민경은(Kyung-Eun Min) 경희대학교 K-컬처·스토리콘텐츠연구소 2024 스토리콘텐츠 Vol.- No.4

본 연구는 노리코 삼부작—<만춘>, <초여름>, <동경 이야기>를 중심으로 오즈 야스지로의 영화에서 여성 재현의 문제를 비판적으로 재고한다. 오즈는 영화에서 가족 공동체를 다룰 때, ‘이에’ 제도에서 비롯된 권위적인 가부장제를 지워버리고 의식적으로 과거의 문제를 생략함으로써 ‘전통적인 가족’이라는 향수만 남긴다. 이때 전통적인 가족이란 전후 일본이 다시 회복해야 하는 것, 인간적인 따뜻함이 존재하는 ‘환상’으로서의 공간이라 할 수 있다. 그리고 여성은 이 환상의 공간에서 개인이 아니라 아내 또는 어머니로만 존재할 수 있다. 게다가 당시 여성 교육 역시 다음 세대 국민을 육성하는 ‘현모’ 개념과 남편을 받들고 가정을 돌보는 ‘양처’론을 합친 ‘양처현모’를 양성하기 위함이었다. 1920년대 이후 일본 사회에 등장한 ‘모던걸’은 이러한 양처현모론과 충돌한다. 오즈는 이 문제를 해결하기 위해 노리코를 모던걸이지만 전통적인 가치관을 지닌 모순적인 인물로 재현한다. 노리코는 결혼을 거부하고 자신의 삶을 주체적으로 꾸려나가는 것처럼 보이지만 가족 공동체에서 벗어날 수 없다. <만춘>과 <초여름>에서 노리코의 자유는 사회가 용인할 수준까지이며 그가 있을 곳은 언제나 ‘집’이다. <동경 이야기>의 노리코는 모던걸보다 일본적 여성의 긍정성이 극대화되어 나타난다. 노리코 삼부작에서 가족 공동체는 해체되거나 이미 해체되었다. 여기서 발생하는 불안감을 해소하고 갈등을 봉합하는 것은 바로 노리코의 결혼이다. 비록 노리코의 현재 가족은 해체되었지만, 노리코가 다른 가부장제 가족 공동체로 편입되어 오즈가 원하는 ‘이상적인 가족’ 세계관이 유지된다. 이 과정에서 ‘개인’ 노리코는 사라지고 ‘양처현모’의 계승자 노리코만 가족 안에 남게 된다. In this study, I critically reconsider the issue of how women are represented in Ozu Yasujiro's Noriko Trilogy-Late Spring(1949), Early Summer(1951), Tokyo Story(1953). When Ozu deals with the family community in his films, he deliberately removes the authoritative patriarchy derived from ‘Ie’ system and consciously omits the problems of the past, leaving only the nostalgia of the ‘traditional family.’ At this point, the traditional family can be said to be space as an ‘illusion’, which Japan must recover again after the war and humane warmth exists. In this space, women can only be wives or mothers, not individuals. Moreover, the purpose of education for women was to train the ideology of ‘good-wife and wise-mother’ that fosters the next generation of citizens and supports the husband and family. ‘Modern girl’, who has appeared in Japanese society since the 1920s, conflicts with this ideology. So Ozu represents Noriko as a contradictory figure-a modern girl with traditional values to solve this problem. Noriko seemingly refuses to marry and stands on her own, but she cannot escape the familyhood. In Late Spring, and Early Summer, Her freedom is to the level that society can tolerate, and where she should be is always at ‘home.’ Noriko in Tokyo Story appears to maximize the positivity of the ideal Japanese woman. The family community has been dissolved or already dissolved in the Noriko trilogy. It is Noriko's marriage that resolves the anxiety and conflict that arise here. Although Noriko's current family has been divided, she is incorporated into another patriarchy, maintaining the ‘ideal family’ that Ozu pursues. In this process, ‘individual’ Noriko disappears and only Noriko, the successor of ‘good-wife and wise-mother’, remains in the family.

CTBN 고무 첨가에 따른 에폭시-점토 나노복합체의 물성 변화

민경은(Kyung Eun Min),이헌봉(Hun Bong Lee),김호겸(Ho Gyum Kim),윤근병(Keun Byoung Yoon),이동호(Dong Ho Lee) 한국고분자학회 2008 폴리머 Vol.32 No.1

n-Butyl Acrylate / Acrylic Acid 공중합체와 점착부여제간의 상용성과 점착물성

민경은(Kyung Eun Min),김호겸(Ho Gyum Kim),최관영(Kwan Young Choi),곽기호(Ki Ho Kwak) 한국고분자학회 2000 폴리머 Vol.24 No.4

플립칩 본딩용 비전도성 접착제의 속경화거동 평가기법

민경은(Kyung-Eun Min),이준식(Jun-Sik Lee),이소정(So-Jeong Lee),이성(Sung Yi),김준기(Jun-Ki Kim) 대한용접·접합학회 2015 대한용접·접합학회지 Vol.33 No.5

The snap cure NCP(non-conducive paste) adhesive material is essentially required for the high productivity flip chip bonding process. In this study, the accessibility of DEA(dielectric analysis) method for the evaluation of snap cure behavior was investigated with comparison to the isothermal DSC(differential scanning calorimetry) method. NCP adhesive was mainly formulated with epoxy resin and imidazole curing agent. Even though there were some noise in the dielectric loss factor curve measured by DEA, the cure start and completion points could be specified clearly through the data processing of cumulation and deviation method. Degree of cure by DEA method which was measured from the variation of the dielectric loss factor of adhesive material was corresponded to about 80% of the degree of cure by DSC method which was measured from the heat of curing reaction. Because the adhesive joint cured to the degree of 80% in the view point of chemical reaction reveals the sufficient mechanical strength, DEA method is expected to be used effectively in the estimation of the high speed curing behavior of snap cure type NCP adhesive material for flip chip bonding.

Blends of Poly ( vinyl methyl ether ) with Styrenic Copolymers

민경은(Kyung Eun Min),Donald R . Paul 한국고분자학회 1988 한국고분자학회 학술대회 연구논문 초록집 Vol.1988 No.4