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개인정보보호관리체계(PIMS)를 이용한 의료정보보호 개선 방안 연구 : 의료기관 종사자를 중심으로
민경은,김성준,Min, Kyeongeun,Kim, Sungjun 디지털산업정보학회 2016 디지털산업정보학회논문지 Vol.12 No.3
This study intends to present an effective and efficient development plan about the information protection of medical institutions, by establishing the improvement plan about Personal Information Management System(PIMS) appropriate to the characteristics of medical information focusing on medical institutions generating and using domestic medical information, and doing an empirical study on medical information protection plan. For this, in view of the medical characteristics of the existing Information Security Management System(ISMS), the study presented a study model appropriated to medical institutions based on Personal Information Management Systems index specialized for personal information, and through this, presented the vulnerability diagnosis and vulnerability improvement plan. Based on ISMS index, it designed an improvement index of personal information protection management about each index. The study conducted a survey for executives and employees about PIMS. Accordingly, it presented vulnerability diagnosis items of the current management system indexes from the viewpoint of the people who establish and mange the personal information protection about patients' medical information targeting executives and employees who serve at hospitals and can access medical information.
민경은 국립민속박물관 2008 민속학연구 Vol.0 No.23
The Onggi mirrors several aspects of Korean living because it has been both useful and indispensable in the life of many Koreans. Upon observing their economic system and customs of faith, this study aims to focus on the unique culture of Onggi shops and enhance one’s understanding of the current Onggi shops. This study especially considers the point that Onggi shops are organizations of people formed around a certain technology of production. When we think about the location of these shops, it is important to remember that Onggi requires a lot of earth and wood materials. Their shops must therefore be conveniently located near a natural environment. It is equally important for Onggi shops to be where there was little human traffic because the culture of the larger society looked down on the masters. So, it was common that Onggi shops were found at the outskirts of the villages, often at the bottom of a mountain where it was easy to shun the public and to get earth materials for Onggi. Until today, existing Onggi shops are located in such environments, which could neither be on a mountain nor in an open field. Such specificity of location led to the ‘collective’ nature of the Onggi shops, so that the people working for the shops lived as though in a village. This collectivity led to a systematic distribution of various works in the different stages of Onggi production. Onggi shop workers were classified into three: the owner, the mill leader and the back workers. A unique system of payment was developed according to the different employment status. The Waritje payment system, the most common system observed in Gyeonggi-do and Chungcheongnam-do, the bounty was divided according to a 6:3:1 ratio for the master, mill leader and back worker, respectively. A similar payment system was the Jibunje system in Gyeongsang-do. In the 1970’s, different payment systems were implemented such as the Gaetgong in Gyeonggi-do and Chungcheong-do, the Dogeubje in Gyeongsang-do and the Chamsuje in Jeolla-do. Payments were made according to the number of Onggis made. This led to the development of specific unitary names for counting Onngis, such as jari or cham, which both served as the unit for paying the wage and the unit for counting the Onggi when selling them. On the other hand, pottery utensils in such areas as Gyeonggi-do, Chungcheong-do, and Gyeongsang-do were called jari. The term is still used in certain shops today. The faith of an individual can have a strong influence on how utensils are produced and how pottery shops were run. As do the name of the units in the Onggi shops, the culture of faith in these shops, which was formed largely in modern times, continues to this day, although parts of it have died away. People observed sacrifice ceremonies upon igniting the furnace on a supposedly auspicious day of the year, such as the day of the Full Moon Thanksgiving. In the late 19th century, Catholic villages began to emerge. They observed practices that coincided with the usual locations and the work distribution system of the Onggi shops. The Catholic faith therefore became involved with Onggi shops so that Catholicism and the production of Onggi became mutually interrelated as generations progressed. Today, we can see Onggi shops led by Catholic believers. In the same light, when the efforts to introduce new believers into the Catholic faith were at their highest, even the Onggi makers in the central inland area became mostly Catholics. For Onggi shops run by Catholic believers, new customs emerged such as obtaining the blessings of the priest instead of observing the sacrifice ceremony. Also, Onggis were made in such as a way that expressed the maker’s faith by using religious Catholic symbols or the shape of cathedrals. The points discussed above imply that further studies on the current Onggi shops and their practices are to be pursued. Although future studies on Onggi shops seem to have a bright future, there i...
민경은,이준식,유세훈,김목순,김준기,Min, Kyung-Eun,Lee, Jun-Sik,Yoo, Se-Hoon,Kim, Mok-Soon,Kim, Jun-Ki 한국재료학회 2010 한국재료학회지 Vol.20 No.12
The application of flip chip technology has been growing with the trend of miniaturization of electronic packages, especially in mobile electronics. Currently, several types of adhesive are used for flip chip bonding and these adhesives require some special properties; they must be solvent-free and fast curing and must ensure joint reliability against thermal fatigue and humidity. In this study, imidazole and its derivatives were added as curing catalysts to epoxy resin and their effects on the adhesive properties were investigated. Non-isothermal DSC analyses showed that the curing temperatures and the heat of reaction were dependent primarily on the type of catalyst. Isothermal dielectric analyses showed that the curing time was dependent on the amount of catalysts added as well as their type. The die shear strength increased with the increase of catalyst content while the Tg decreased. From this study, imidazole catalysts with low molecular weight are expected to be beneficial for snap curing and high adhesion strength for flip chip bonding applications.
Cu-Cu 접착부의 고온고습 내구성에 미치는 경화제 및 촉매제의 영향
민경은,김해연,방정환,김종훈,김준기,Min, Kyung-Eun,Kim, Hae-Yeon,Bang, Jung-Hwan,Kim, Jong-Hoon,Kim, Jun-Ki 한국재료학회 2011 한국재료학회지 Vol.21 No.5
As the performance of microelectronic devices is improved, the use of copper as a heat dissipation member is increasing due to its good thermal conductivity. The high thermal conductivity of copper, however, leads to difficulties in the joining process. Satisfactory bonding with copper is known to be difficult, especially if high shear and peel strengths are desired. The primary reason is that a copper oxide layer develops rapidly and is weakly attached to the base metal under typical conditions. Thus, when a clean copper substrate is bonded, the initial strength of the joint is high, but upon environmental exposure, an oxide layer may develop, which will reduce the durability of the joint. In this study, an epoxy adhesive formulation was investigated to improve the strength and reliability of a copper to copper joint. Epoxy hardeners such as anhydride, dihydrazide, and dicyandiamide and catalysts such as triphenylphosphine and imidazole were added to an epoxy resin mixture of DGEBA and DGEBF. Differential scanning calorimetry (DSC) analyses revealed that the curing temperatures were dependent on the type of hardener rather than on the catalyst, and higher heat of curing resulted in a higher Tg. The reliability of the copper joint against a high temperature and high humidity environment was found to be the lowest in the case of dihydrazide addition. This is attributed to its high water permeability, which led to the formation of a weak boundary layer of copper oxide. It was also found that dicyandiamide provided the highest initial joint strength and reliability while anhydride yielded intermediate performance between dicyandiamide and dihydrazide.