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장철섭(C. S. Jang),오승규(S. K. Oh),김종현(J. H. Kim),황영택(Y. T. Hwang),이원(W. Yi) 한국정밀공학회 2004 한국정밀공학회 학술발표대회 논문집 Vol.2004 No.10월
This article discusses the use of pulse-echo ultrasonic testing for the stress analysis of adhesive bonds between metal sheets. The method is based on the measurement of the reflection wave at the metal/adhesive interface. After describing briefly the physical aspects of the phenomenon, an index is defined to detect defective zone of the joint(both for the lack of adhesive and for insufficient adhesion); the influence of the experimental variables(variable stress...) on the measurement is discussed. By means of a control experiment it is shown that Stress Variation in Adhesive Joints are separate to be distinguished. In this paper, Quantitative Nondestructive Evaluation in Adhesive Joints are evaluated together with Ultrasonic Testing and Finite Element Method.