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환경친화적 Pb-free solder/Cu Pad 접합부의 크리프 특성
함영필(Youngpil Ham),유효선(Hyosun Yu),양성모(Sungmo Yang) 한국자동차공학회 2011 한국자동차공학회 학술대회 및 전시회 Vol.2011 No.11
In this research, the creep time to rupture of 2 solder joints according to the reflow times (10sec, 30sec, 100sec, 300sec) was compared against the Pb eutectic solder (Sn-37Pb) joint which performed the Shear Punch-Creep test of the Sn-4Ag/Cu Pad joints and by using the Sn-4Ag, that is the lead-free solder alloy, that is the environmentally friendly of the electronic component, in which presently the use is limited to the environment problem and the creep resistance of the Pb-free Sn-4Ag solder alloy was evaluated. When comparing the creep life about 3 reflow times, in case it reflowed about 2 solder joint departments with 100sec, the time to rupture which is the longest in 37h and Sn-37Pb in Sn-4Ag for 0.26h was displayed. In addition, when considering the time to rupture, the creep strength of the Sn-4Ag of the time to rupture of the Sn-4Ag solder joint is especially more excellent in the identical creep stress condition to the time to rupture of the Pb eutectic solder joint over the maximum hundredfold with each reflow time since exposed to is being long.
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