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Do Hoon Cho(조도훈),Sri Harini Rajendran,Hye Jun Kang(강혜준),Jae Pil Jung(정재필) 대한용접·접합학회 2021 대한용접학회 특별강연 및 학술발표대회 개요집 Vol.2021 No.5
The nickel-based superalloy of Inconel 600 containing high chromium content was developed as a superior corrosion resistance in acidic environments. Since the Inconel 600 shows high corrosion resistance and good fatigue strength, the Inconel 600 has been utilized in high temperature environments such as heat treatment furnace parts and industrial vacuum equipment components. Inconel X-750 is also a austenitic nickel alloy, is widely used in heat exchanger, chemical containers and metallurgical industries because of its good corrosion resistance and heat resistance. Fiber laser welding is an advanced welding method which gives high energy density, minimization of heat-affect zone, high heating-cooling speed, less thermal-stress, and so on. The joint can be applicable to the high temperature parts such as various engine and airframe components, exhaust liners, muffles, turbine seals and etc. In the present study, Inconel 600 and X-750 were welded using QCW fiber laser from IPG and their microstructure and the mechanical properties were analyzed. The experimental results showed that Inconel 600 and Inconel X-750 were welded successfully with good bead appearance. The welded joint gave deep penetration, and the microstructure of fusion zone exhibited mainly columnar dendrites. The as-welded samples were subjected to heat treatment at various temperature. The microstructure of the weld pool and the corresponding tensile strength & elongation for welded joints were characterized from Scanning Electron Microscope and weld-joint tensile tests. The hardness of the weld zone before and after heat treatment were evaluated using Vickers micro hardness tester.
TSV (Through-Si-Via) 기술을 이용한 반도체의 3차원 적층 실장
조도훈(Do Hoon Cho),강혜준(Hye Jun Kang),서성민(Seong Min Seo),김장백(Jang Baeg Kim),스리하리니 라젠드란(Sri Harini Rajendran),정재필(Jae Pil Jung) 대한용접·접합학회 2021 대한용접·접합학회지 Vol.39 No.3
Recently, the electronics industry is developing toward artificial intelligence, the Internet of things, fifth-generation technology, and high-performance computing. High-density electronics packaging, high speed, high performance, and miniaturized size are required to satisfy these trends. Three-dimensional Si-chip stacking using through-Si via (TSV) has attracted the attention of industries related to these requirements. In this study, TSV fabrication using the deep reactive ion-etching process and the coating of functional layers on the TSV wall, such as insulating, adhesion, and seed layers, were investigated. In addition, Cu electroplating in the TSV was analyzed in detail. The solutions to other accompanied technical barriers for packaging high-density electronics can improve smartness and convenience.
김장백,서성민,강혜준,조도훈,스리 하리니 라젠드란,정재필,Kim, Jang Baeg,Seo, Seong Min,Kang, Hye Jun,Cho, Do Hoon,Rajendran, Sri Harini,Jung, Jae Pil 한국마이크로전자및패키징학회 2021 마이크로전자 및 패키징학회지 Vol.28 No.1
Sn-3wt%Ag-0.5wt%Cu (SAC305) solder is most popular solder in electronics industry. However, SAC305 has also drawbacks such as growth of β-Sn phase, intermetallic compounds (IMCs) of Ag3Sn, Cu6Sn5 and Cu3Sn which can result in deterioration of solder joints in terms of metallurgically, mechanically and electrically. Thus, improvement of SAC305 solders have been investigated continuously by addition of alloying elements, nano-particles and etc. In this paper, recent improvements of SAC solders including nano-composite alloys and related solderabilty and metallurgical and mechanical properties are investigated.