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무전해 Ni-Cu-B 도금속도에 미치는 도금조건과 표면상태의 영향
오이식,정두윤 釜慶大學校 1999 釜慶大學校 論文集 Vol.4 No.1
Using DMAB as reducing agent, the relation between some plating condition and the rate of deposition plated film for electroless Ni-Cu-B alloy was investigated. The result obtained from thisexperiment summarized follow; It was found that the optimum bath component consisted of 0.8ppm thiourea as stabilizing agent. Plating rates of nickel-catalytic surface and zincated-catalytic surface, both found to be very closely equal, and plating time of nickel-catalytic surface took longer plating time than that of zincated-catalytic surface. Composition of deposit found to be uniform after delectroless plating for two hours.
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무전해 Ni-Cu-B 도금속도에 미치는 도금욕 조성과 도금조건의 영향
오이식,정두윤 釜慶大學校 1998 釜慶大學校 論文集 Vol.3 No.2
Using several complexing agents, plating rate and plating condition of electroless Ni-Cu-B plating have been studied. The result obtained from this experiment summarized as follow: It was found that the optimum bath composition consisted of 0.1M nickel sulfate, 0.02M copper sulfate, 0.07M DMAB as reducing agent and 0.15M malic acid as complexing agent, whereas the bath of pH 8 adjusted by ammonia solution and 70℃of bath temperature gave good result. The activation energy between 40℃ and 70℃ was calculated to be 34.8 kj/mole for deposition. Plating reaction had been ceased by increase of temperature above 90℃, pH higher than 8 and under 4. Deposited surface became worse in case of the increase of bath temperature above 80℃.
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