汾西 朴瀰의 書畵애호와 그 기록 : 「丙子亂後集舊藏屛障記」를 중심으로

이성민(Lee, seong-min) 동양한문학회 2011 동양한문학연구 Vol.32 No.-

汾西 朴?는 병자호란이 끝난 뒤 강화도에서 돌아와, 소장하고 있던 8점의 서화 작품들을 다시 裝幀하여 병풍으로 만들었다. 그리고 ?丙子亂後集舊藏屛障記?라는 제목 하에 총 8편의 記를 지었다. 이 글에는 서화 品評에 뛰어났던 박미의 모습을 비롯하여 當代 서화계의 다양한 품평 활동이 기록되어 있다. 아울러 서화와 관련된 다수의 逸話가 채록되어 있다. 따라서 17세기 전반기 서화계의 실상을 보여주는 중요한 자료이다. ?丙子亂後集舊藏屛障記?의 내용은 4가지 정도로 요약할 수 있다. 첫째는 宣祖의 御筆 서화에 대한 品評으로, 宣祖의 서화 취향과 성취를 기록하였다는 점에 의의가 있다. 둘째, 當代의 전문적 서화 품평 활동에 관한 내용을 기록하였다. 특히 뛰어난 서화 품평가로서 白沙 李恒福의 위상이 잘 나타나있다. 셋째, 서화 관련 일화의 채록이다. 초상화에 뛰어났던 李信欽 관련 일화는 여타 기록에 보이지 않는 흥미로운 기록이다. 이 일화들은 17세기 전반기 조선 서화계의 이면을 보여준다는 점에서 중요하게 다루어야 한다. 넷째 松雪體에서 王羲之體로의 書體 변화에 대한 박미의 비판적 입장을 확인할 수 있는데, 이 점에 대해서는 보다 구체적인 고찰이 필요하다. ?丙子亂後集舊藏屛障記?는, 題跋 등을 통해 산발적으로 이루어지던 이전 시기 서화 관련 논의의 형태를 벗어나, 같은 제목 하에 서화만을 집중적으로 논의한 ‘최초의 기록’이라는 점에서 그 가치를 평가할 수 있다. Bunseo Park-Mi returning from Kanghwa(江華) Island after Byeongja-horan was over made folding screen again by arranging 8 pieces of work of calligraphy and paintings. And he wrote total 8 writing with title of Byeongjananhu-jipgujangbyungjangi(丙子亂後集舊藏屛障記), meaning of recording document that was written after manufacturing folding screen with collecting old paintings owned by him after Byeongja-horan was over. Various evaluation activities of calligraphy and paintings world at that time were recorded in this writing. Together, many anecdotes related to calligraphy and paintings were collected. Therefore, it is important data that show actual circumstances of calligraphy and paintings world at first half years of 17th century. The contents of this writing can be summarized by four. First, that make evaluation about King Seonjo(宣祖)'s work, there is a meaning that recorded King Seonjo's inclination and accomplishment of calligraphy and paintings. Second, it recorded contents about professional calligraphy and paintings evaluation activity at that time. Especially, he raised the image of Baeksa Lee-hangbok(李恒福) as excellent calligraphy and paintings evaluator. Third, it is collection of anecdotes of calligraphy and paintings. These anecdotes are important at point that show part which it is not known well of Joseon dynasty calligraphy and paintings world at first half years of 17th century. Fourth, we can confirm Park-Mi's critical standpoint about change from Songseolche(松雪體) to Wangheejiche(王羲之體), need more specific investigation about this point. Byeongjananhu-jipgujangbyungjanggi, escaping discussion form related to calligraphy and paintings attained sporadically through Jebal(題跋) at previous time, can be evaluated by the value of “The first recording” that discuss only calligraphy and paintings intensively under same title.

리드 온 칩 패키징 기술을 이용하여 조립된 반도체 제품에서 패시베이션 박막의 TC 신뢰성에 영향을 미치는 요인들

이성민,이성란,Lee, Seong-Min,Lee, Seong-Ran 한국재료학회 2009 한국재료학회지 Vol.19 No.5

This article shows various factors that influence the thermal-cycling reliability of semiconductor devices utilizing the lead-on-chip (LOC) die attach technique. This work details how the modification of LOC package design as well as the back-grinding and dicing process of semiconductor wafers affect passivation reliability. This work shows that the design of an adhesion tape rather than a plastic package body can play a more important role in determining the passivation reliability. This is due to the fact that the thermal-expansion coefficient of the tape is larger than that of the plastic package body. Present tests also indicate that the ceramic fillers embedded in the plastic package body for mechanical strengthening are not helpful for the improvement of the passivation reliability. Even though the fillers can reduce the thermal-expansion of the plastic package body, microscopic examinations show that they can cause direct damage to the passivation layer. Furthermore, experimental results also illustrate that sawing-induced chipping resulting from the separation of a semiconductor wafer into individual devices might develop into passivation cracks during thermal-cycling. Thus, the proper design of the adhesion tape and the prevention of the sawing-induced chipping should be considered to enhance the passivation reliability in the semiconductor devices using the LOC die attach technique.

지각과민 치아에 대한 처치약재의 임상적 연구

이성민,이찬영,이승종,박동수,Lee, Seong-Min,Lee, Chan-Young,Lee, Seung-Jong,Park, Dong-Soo 대한치과보존학회 1989 Restorative Dentistry & Endodontics Vol.14 No.1

The purpose of this study was to evaluate the periodic effect of desensitizing drug such as potassium oxalate(D.D.S. # I&II), strontium chloride (ZAROSEN)$^{(R)}$, and placebo group. The 193 teeth of 93 patients who had been complained dental hypersensitivity, and were divided into three groups by application agent and desensitizing treatment was completed. The interval of observation and treatment period were immediately, 1 week, 2 week, 3 week, 4 week, before and after treatment. The data was statistically analized and the results were as followed. 1. Group I showed best desensitizing effect to the stimuli, followed by Group II, Group III. 2. There was a significant difference (p < 0.005) in desensitizing effect among the Group I, Group III and Group II, Group III but there was no significant difference (p < 0.005) in Group I, Group II. 3. The cold stimuli was most effective in desensitization and there was a significant difference (p < 0.005) in cold, air-blast, but there was no significant difference (p < 0.005) in other stimuli. 4. There was no significant difference (p < 0.005) in effect of the desensitization of the cause of exposed dentine. 5. Anterior teeth was more effective than posterior teeth in desensitization and there was a significant difference (p < 0.005) between anterior teeth and posterior teeth. 6. In analysis of stimuli on the potassium oxalate, there was a significant difference (p < 0.005) in cold, air-blast but there was no significant difference (p < 0.005) in other stimuli.

전자수출 천억달러 달성-팹리스 기업의 역활

이성민,Lee, Seong-Min 한국정보통신집흥협회 2006 정보화사회 Vol.180 No.-

팹리스 기업들이 연구개발에 몰두해서 내어 놓은 수 많은 제품들도 결국은 사람의 삶을 가치 있게 만드는 일에 사용되어 왔다. 앞으로 펼쳐질 무한한 유비쿼터스 세상, 그 핵심에 그렇게 사람을 생각하는 팹리스 기업들의 열정이 있고, 그러한 열정은 한국을 전자수출 강국으로 만드는 윤활유가 되어 줄 것이다.

Electronic Packaging에 쓰이는 공정 조성의 Pb-Sn Solders에서 Grain Boundary Sliding과 관련된 계면파괴현상

이성민,Lee, Seong-Min 한국재료학회 1994 한국재료학회지 Vol.4 No.3

Pb-Sn eutectic bulk specimens을 thermal cycling동안 electronic package의 땜납이 격게되는 변형 조건 즉 $10^{-3}-10^{-5}$/s정도의 낮은 frequency와 0.2-1%정도의 적당한 strain range에서 피로파괴 실험을 했을때, grain boundary sliding과 관련하여 임계면을 따라 일어나는 균열이 5단계에 의해 묘사될 수 있다는 것을 보였음. This report details the microscopic aspects of grain boundary cracking in Pb-Sn eutecticduring displacement-controlled mechanical tests performed over a range of low frequency ($10^{-3}-10^{-5}$/s)and moderate strain range (0.2 - 1 %) where is the most technologically relevant to solder jointssubjected to thermal cycling. It is shown that intergranular cracking begins with the appearance ofcrack-like features (CLF's), which can be seen due in part because they are associated with grainboundary sliding, and is able to be described by certain stages of isolated crack growth. In the initialstages CLF's are not ture cracks but instead what I shall call "proto-cracks" where grain boundarysliding begins to damage the gram boundary at the surface. At some point during the initiation stagesonce proto-cracks become ture cracks, they develop into isolated cracks and the growth of isolatedcracks is eventually accomplished by coalescence, resulting in 5 stages of cracking.ing in 5 stages of cracking.

부호분할다중화 전송방식의 대전자전 능력 분석

이성민,김환우,Lee, Seong-Min,Kim, Whan-Woo 한국군사과학기술학회 2008 한국군사과학기술학회지 Vol.11 No.5

In this paper, we have introduced a Code Division Multiplexing transmission method which is similar to OFDM and analyze ECCM performances. We have verified CDM transmission method has a good LPI performance and a feasible ECCM performance. This capability could be useful for reduction of RF interference which occurs when many equipments operate densely in small area. The equipment that uses CDM transmission method supports variable transmission rate and order-wire effectively and conveniently to user. This CDM method has similar ECCM performance comparing to serial DS method. CDM method has good multi-path signal processing capability and could be useful for mobile communication environment.

온도 변화에 지배되는 LLCC Solder접합부에서 균열이 일어난 계면에 대한 불순물 편석

이성민,Lee, Seong-Min 한국재료학회 1994 한국재료학회지 Vol.4 No.3

A large number of grain boundaries were seen to crack in near-eutectic solder joints of leadless ceramic chip carriers (LLCC's) during thermal cycling at temperature ranges from -$35^{\circ}C$ to +$125^{\circ}C$ with lhr time period. One potential explanation for this type of cracking might be the presence of embrittling species on the boundary. Although there do not appear to be any instances reported in the literature of solders being embrittled by small amounts of contaminating species, the possibility of such an occurrence exists. The potential presence of impurities located at crack surfaces was inspected using Scanning Auger Microprobe(SAM) and it was found that intergranular cracking could be accomplished by the oxidation of the grain boundary. A physical model for fatigue crack growth was introduced, in which grain boundary separation took place under oxidation facilitated by sliding. 1시간 주기로 -$35^{\circ}C$에서 +$125^{\circ}C$까지의 온도 변화에 지배되는 Leadless Ceranic Chip Carriers(LLCC'S)의 Solder접합부에서 균열이 계면을 따라 일어났다. 이런 균열이 계면을 취약하게 하는 어떤 불순물에 의한 것이 아닌지를 Scanning Auger Microprobe(SAM)을 이용해 조사했다. 그 결과 계면을 따라 일어나는 균열이 계면의 산화에 의해 일어날 수 있다는 것이 발견되었고, 그에 따라 산화에 취약해진 계면을 따라 일어나는 이런 종류의 피로 파괴현상에 대한 모델을 제시했다.

벤처인의 선택은 아름다운 모험

이성민,Lee, Seong-Min 벤처기업협회 2005 벤처다이제스트 Vol.84 No.-

웨이퍼의 2단 이면공정이 반도체 칩의 휨 강도에 미치는 영향

이성민,Lee Seong Min 한국재료학회 2005 한국재료학회지 Vol.15 No.3

It was studied in this article how the flexural strength of bare silicon chips is influenced by adopting dual wafer back-lapping process. The experimental results showed that an additional finishing process after the conventional grinding process improves the flexural strength of bare chips by more than 2-fold. In particular, this work showed that the proper removal of the grinding marks$(Ra=0.1\;{\mu}m)$existing on the wafer back-surface resulting from the grinding process significantly contiributes to the enhancement of chip strength.

석회석광산 지하대형공간의 재난관리를 위한 업무영향력 분석

이성민,김선명,이연희,Lee, Seong-Min,Kim, Sun-Myung,Lee, Yeon-Hee 한국터널지하공간학회 2013 한국터널지하공간학회논문집 Vol.15 No.6

현재 국내 석회석광산은 개발 방식 및 특성에 따라 환경적, 사회적, 경영적 측면에서 다양한 문제 등을 내포한 채 운영되고 있다. 따라서 최근에는 이 같은 문제점들을 저감하고 지속가능한 광산개발을 위하여, 갱내채광 혹은 시설물 갱내화 등 다양한 노력이 계속되고 있다. 이러한 노력은 기존의 광산개발 공간 외에 새로운 지하대형공간의 생성을 유발하기 때문에, 작업자 및 시설물의 안전성확보를 위하여 발생 가능한 다양한 종류의 리스크에 대한 재난관리 필요성이 제기되고 있다. 본 연구에서는 지하대형공간을 구축하고 시설물을 갱내화하여 본격가동을 앞둔 석회석광업현장의 작업자들을 대상으로 설문조사를 실시하여 리스크 위험도평가 및 업무영향력분석 후 재난관리를 위한 업무우선순위를 도출하였다. 그 결과, 대상 현장의 경우 파분쇄 및 분립선별공정에서 안전수칙 불이행으로 인한 리스크에 대하여 위험도가 가장 높은 것으로 나타났다. 또한, 이 리스크에 대한 재난발생시 업무연속성 유지를 위한 영향력을 분석결과 우선적으로 갱내외의 연계작업이 원활하게 이루어지도록 해야 하는 것으로 나타났다. As Limestone mines have been operated with various environmental, societal and managemental problems depending on their characteristics and developing methods, many great efforts have been applied to solve these problems. Installing the mining facilities underground is one of the successful efforts to keep the sustainable limestone mine development. This effort could reduce these problems. However, unfortunately it made an side effect of constructing a large underground space in mining site. Moreover, this space caused a necessity of various disaster managements for the safety of workers and facilities. This study introduces the priority list of a limestone mining process if there are disasters in underground mining site. This result is coming from the risk assessment and business impact analysis on survey data which were obtained from the miners of that particular limestone mine. According to the result, the highest risk is 'disregard of safety guidelines in crushing & classifier process'. The result also shows the highest priority business, above all things, is 'a pit linked work of in & out process'.