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RISS 인기검색어
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- 저자 : 이도재 ( Youn Jong Seo (검색결과 3 건)
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Sn-Bi-Ag 계 땜납과 Cu 기판과의 젖음성 , 계면 반응 및 기계적 성질에 관한 연구
서윤종,이경구,이도재 ( Youn Jong Seo,Kyung Ku Lee,Doh Jae Lee ) 한국주조공학회 1997 한국주조공학회지 Vol.17 No.3
N/A Solderability, interfacial reaction and mechanical properties of joint between Sn-Bi-Ag base solder and Cu-substrate were studied. Solders were subjected to aging treatments to see the change of mechanical properties for up to 30 days at 100℃, and then also examined the changes of microstructure and morphology of interfacial compound. Sn-Bi-Ag base solder showed about double tensile strength comparing to Pb-Sn eutectic solder. Addition of 0.7wt%Al in the Sn-Bi-Ag alloy increase spread area on Cu substrate under R-flux and helps to reduce the growth of intermetallic compound during heat-treatment. According to the aging experiments of Cu/solder joint, interfacial intermetallic compound layer was exhibited a parabolic growth to aging time. The result of EDS, it is supposed that the soldered interfacial zone was composed of Cu_6Sn_5.
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Sn-3.5wt.%Ag- 1wt.%Zn 땜납과 Cu 기판간의 미세조직 및 계면반응
백대화(Dae Hwa Baek),서윤종(Youn Jong Seo),이경구(Kyung Ku Lee),이도재(Doh Jae Lee) 한국주조공학회 2002 한국주조공학회지 Vol.22 No.2
N/A This study examined the effects of adding Zn to Sn-3.5Ag solder on the microstructure changes and behavior of interface reaction of the solder joint with Cu substrate. The solder/Cu joints were examined with microscope to observe the characteristics of microstructure changes and interfacial reaction layer with aging treatment for up to 120 days at 150℃. Results of the microstructure changes showed that the microstructures were coarsened with aging treatment, while adding 1%Zn suppresses coarsening microstructures. The Sn-3.5Ag/Cu had a fast growth rate of the reaction layer in comparison with the Sn-3.5Ag-1Zn at the aging temperature of 150℃. Through the SEM/EDS analysis of solder joint, it was proved that intermetallic layer was Cu_6Sn_5 phase and aged specimens showed that intermetallic layer grew in proportion to t^1/2, and the precipitate of Ag_6Sn occur to both inner layer and interface of layer and solder. In case of Zn-containing composite solder, Cu_6Sn_5 phase formed at the side of substrate and Cu-Zn-Sn phase formed at the other side in double layer. It seems that Cu-Zn-Sn phase formed at solder side did a roll of banrier to suppress the growth of the Cu_6Sn_5 layer during the aging treatment.
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Bi 를 첨가한 Sn-3.5wt.%Ag 땜납의 미세조직 및 기계적 성질
이경구(Kyung Ku Lee),백대화(Dae Hwa Baek),서윤종(Youn Jong Seo),이도재(Doh Jae Lee) 한국주조공학회 2001 한국주조공학회지 Vol.21 No.4
N/A Microstructure and mechanical properties of Sn-3.lwt% Ag-6.9wt% Bi system solders on Cu-substrate were studied. The Sn-3.1wt% Ag-6.9wt% Bi alloy was designed by phase diagram and chemical properties and was prepared by melting in argon atmosphere. The mechanical properties of solder/Cu joints were examined by shear strength test, and also creep test. The microstructure of Sn-3.1wt% Ag-6.9wt% Bi alloy consists of Bi-rich phase and Ag₃Sn precipitate in β-Sn matrix phase. The shear strength of the joint was decreased with aging treatment. Crack path under shear test was through the solder. Similar crack path change mode was observed at the creep test of solder/Cu joint. The creep behavior of Sn-3.1wt% Ag-6.9wt% Bi alloy represented the inverse primary creep behavior at all test condition. It is suggested that the inverse primary creep behavior is induced from Bi solute atoms in Sn-matrix. The creep resistance of Sn-3.1 Ag-6.9Bi alloy is better than that of Sn-3.5wt% Ag alloy at all test conditions.
ScienceON
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