http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
- 中文 을 입력하시려면 zhongwen을 입력하시고 space를누르시면됩니다.
- 北京 을 입력하시려면 beijing을 입력하시고 space를 누르시면 됩니다.
RISS 인기검색어
- 검색키워드
- 저자 : 유길영(Kilyoung Yu) (검색결과 2 건)
- 무료
- 기관 내 무료
- 유료
-
유길영(Kilyoung Yu),양성모(Sungmo Yang),유효선(Hyosun Yu) 한국자동차공학회 2009 한국자동차공학회 지부 학술대회 논문집 Vol.2009 No.10
Every electronic equipment in vehicles, mobile phone or other machines is manufactured by soldering which is micro joining technology. Soldering is a method which connects two solids using molten solder and it is the most important technology in electronic assemblies of substrate, element, semi-conductor and joining part. Because of the Pb inherent toxicity, studies of Pb-free solder are increasing widely. Therefore it has to be the shear characteristic of a solder evaluated by a solder. By using the database according to this, the reliability evaluation technology of the solder joints tries to be formulated. In this paper, the solder used the Sn37Pb, Sn-4Ag and the Sn4ag0.5Cu. The shear properties the modeled specimen was predicted through FEM. It compared with the test value in which it obtains from Shear-Punch. Also, a method which can obtain shear properties of Pb-free solder joints easily and quickly using FEM was proposed.
-
유길영(Kilyoung Yu),양성모(Sungmo Yang),유효선(Hyosun Yu) 한국자동차공학회 2009 한국자동차공학회 학술대회 및 전시회 Vol.2009 No.11
Because of the Pb inherent toxicity, studies of Pb-free solder are increasing widely. Accordingly, the specimen in which it considers the intermetallic compound (IMC) in which it is generated a solder and copper plate in order to evaluate the shear property of the solder joints was predicted through the Shear-Punch test and FEM. By using the database according to this, the reliability evaluation technology of the solder joints tries to be formulated. In this paper, the solder used the Sn37Pb, Sn-4Ag and the Sn4ag0.5Cu. When solder melted in the copper interface, the solder joints according to reflow times (10sec, 30sec, 100sec, 300sec), each modeling required for the Shear-Punch was made in consideration of the IMC layer thickness. The shear properties the modeled specimen was predicted through FEM. It compared with the test value in which it obtains from Shear-Punch. Also, a method which can obtain shear properties of Pb-free solder joints easily and quickly using FEM was proposed.
연관 검색어 추천
이 검색어로 많이 본 자료
활용도 높은 자료
