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Droplet-Based Manufacturing 공정에 의해 제조된 무연 솔더볼의 제조공정 변수 연구
엄호천,조경목,송인혁,한유동 대한금속재료학회 2003 대한금속·재료학회지 Vol.41 No.1
Uniform droplet of lead-free solder balls was produced by using the Droplet-Based Manufacturing(DBM) process. Compositions of solder were Sn, Sn-3.6 wt.% Ag, and Sn-3.8 wt.%Ag-0.6 wt.% Zn. Effect of parameters such as orifice size, pressure difference, and frequency on the solder ball production was also investigated. Mean size, size distribution, and surface defect of solder balls were analyzed with variations of the parameters. Droplet spacing decreased with increasing frequency and decreasing pressure difference. Thus the size of solder ball decreased with increasing frequency and decreasing pressure difference. Size distribution fell within the narrow range of ±5% from the mean diameter of solder balls. The experimentally measured diameter of the solder balls fabricated by DBM process coincided quite well with the theoretically anticipated value of d_d=A d_o^2/3.