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플립칩 솔더 접합부의 신뢰성 평가를 위한 보드레벨 낙하해석
김성걸,김주영,김상현,양우찬,정호동,김재호 한국공작기계학회 2008 한국공작기계학회 추계학술대회논문집 Vol.2008 No.-
Recently, with the trend towards miniaturization and multi-functionality in electronic products such as mobile phone, miniature IC packages such as Flip Chip package have brought new reliability problems. Reliability of IC packages during the drop impact becomes a critical issue. A Flip Chip package with solder bump composition of Sn-1.2Ag-O.7Cu was modeled, and dynamic response of the drop was analyzed by implicit finite element. analysis (FEA) with ANSYS Multiphysics. Also, model analysis was performed. In the results of the drop impact simulation, the stress and strain state in the solder joints were determined. Various peak acceleration shock G-levels and 0.5msec duration time were applied on the basis of JEDEC standard such as JESD22-B111.