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[구조강도부문] 형상비와 점용접 상대위치변화가 용접된 두 사각평판의 좌굴응력에 미치는 영향
한근조(GeunJo Han),안성찬(SeongChan Ahn),심재준(JaeJoon Shim),이현철(HyounChul Lee),한동섭(DongSeop Han) 한국자동차공학회 2000 한국자동차공학회 춘 추계 학술대회 논문집 Vol.- No.-
The stability of a plate structure is very crucial problem. Because the buckling strength of thin plates is lower than the yield strength of the material, spot welded reinforcement material is commonly used. But, the spot welding is practically designed by experiential decisions, so it is inefficient and has the risks of buckling demolition. In this study, relative location of spot welding was chosen for parameter and the result shows that the maximized reinforcement effect relative location of spot welding under compression were that on the condition of r<=1. in model I, model Ⅱ, relative locations of longitudinal and transverse directions were around the center of each available region, relative locations of model J] were symmetrically according to boundary line of separated regions, in model Ⅲ, relative locations were around the center and the shape of the locations was arrayed like V, that on the condition of r>=1, the results were similar to the above. And the case of shearing, relative locations were similar to that of compression, but were closer to the center of each available region than compression.
심재준,이성욱,한동섭,김태형,이상석,한근조 東亞大學校 大學院 2005 大學院論文集 Vol.30 No.-
MEMS structures generally have been fabricated using surface-machining method, but the interface failure between silicon substrate and evaporated thin film frequently was taken place due to the residual stress induced by the fluctuated thermal loads. Therefore this paper studied the residual stress caused the thermal loads in the thin film and introduce the simple method to measure the trend of the residual stress by the indentation. Specimens were made from varialde materials such as Al, Au and Cu and thermal load was applied repeatedly. The residual stress was measured by Finite Element Analysis and the existence of the residual stress due to thermal load was verified by the experimental results. The indentation length of the thermal loaded specimens increased maximum 15% comparing with the virgin thin film caused by tensile residual stress. The finite element analysis results are similar to indentation test.