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박관흠(KwanHum Park),이근배(Keunbae Lee) 한국자동차공학회 2004 한국자동차공학회 Symposium Vol.- No.-
Recently, automotive OEM has been pushing forward the outsourcing and modulization to strengthen the competitiveness through reducing cost and developing periods, improving productivity and quality and etc. Therefore, Tiers are now trying to get their own technologies to carry out design, manufacturing and evaluation during vehicle development, exclusively. OEM and Tiers share data each other from design stages and make efforts on improving skills and raising efficiency through collaboration. This paper describes the schemes for effective collaboration through the examples that shows sharing works using CAE between OEM and Tier.<br/>
CFD/FEM 에 의한 엔진 배기 매니폴드의 열피로 특성 해석
최복록(Boklok Choi),박재인(Jaein Park),장훈(Hoon Chang),박관흠(Kwanhum Park) 한국자동차공학회 2002 한국자동차공학회 춘 추계 학술대회 논문집 Vol.2002 No.5_3
This paper presents a numerical method for the engine exhaust manifold subject to severe cyclic thermomechanical loading. The analyses based on the geometry of the exhaust manifold, temperature dependent material properties as well as nonlinear stress-strain relationship, proper boundary conditions, and temperature distribution data equivalent to the thermal cycles. As a result of nonlinear thermal stress analysis, compressive plastic deformations occurred during heating process since the thermal expansion of the manifold was restricted by less expanded inlet flange and cylinder head. And, tensile stress remained when the manifold was cooled down to the ambient temperature. From these repetitions of heating and cooling, we can obtain the stress-strain hysteresis loop in a critical zone. The estimated plastic strain range was often used as the crack initiation criteria. This method was applied to assess the characteristics of the low cycle thermal futigue for the "A" engine exhaust manifold. The results show a good agreement between numerical analysis and experimental results.
고종수(Jong Soo Ko),김규현(Kyu Hyun Kim),이창열(Chang Yeol Lee),조영호(Young-Ho Cho),이귀로(Kwyro Lee),곽병만(Byung Man Kwak),박관흠(Kwanhum Park) 한국자동차공학회 1995 한국자동차공학회 춘 추계 학술대회 논문집 Vol.1995 No.6_2
A silicon microaccelerometer is designed and fabricated using silicon epitaxial layers for automotive electronic airbag applications. A cantilever structure is chosen for high sensitivity and a piezoresistive detection method is adopted for circuit simplicity and low cost. An optimum design is used to find optimum microstructure sizes for maximum sensitivity subject to performance requirements and design constraints on natural frequency, damping ratio, maximum allowable stress and microfabrication limitations. The microaccelerometer is fabricated by micromachining processing steps, composed of material-selective and orientation-dependent chemical etching techniques. Fabricated prototype shows a sensitivity of 88.6μV/g within a resonant frequency of 1.75kHz. Estimated performance of the microaccelerometer is compared with measured one. Discrepancy between the theoretical values and the experimental values is discussed together with possible sources of the errors.<br/>