플라스마 디스플레이 패널에서 ITO/black interlayer/Bus 전극 간의 전기저항 평가

문철희 ( Cheol Hee Moon ) 대한금속ᆞ재료학회 2008 대한금속·재료학회지 Vol.46 No.2

Al-15Cu-1Mg 합금의 일방향응고시 시편의 길이변화에 따른 응고거동변화

문철희 ( Cheol Hee Moon ) 한국주조공학회 1997 한국주조공학회지 Vol.17 No.4

N/A Al-15Cu-1Mg alloys have been directionally solidified in 3㎜ diameter alumina tubes under the conditions of 760℃ of furnace temperature and 12㎝/hr of furnace moving velocity(V). By analyzing the evolution of the temperature profiles along the alloy length, the position of the solid/liquid interface, temperature gradient(G) and local growth velocity (R) were determined. These growth characteristics were compared for 6, 10, 14㎝ length alloys. Steady state growth region was obtained in 15㎝ length alloy, not in 6, 10㎝.

3인치 PDP (폴라즈마디스플레이 ) 패널제작

문철희(Cheol Hee Moon) 호서대학교 공업기술연구소 2005 공업기술연구 논문집 Vol.24 No.1

PDP (Plasma Diplay Panel) consists of two glass plates on which electrodes and dielectric layers are placed. Each pixels are separated with barrier ribs and emit visible lights by plasma of discharge gases inside and photo-luminescence of phosphors coated on the barrier ribs. In this experiments, 3 inch cell structure was designed and laboratory facilities for manufacturing PDP panel were built up. 3 inch PDP panel was manufactured with these facilities.

P D P (플라즈마 디스플레이 판넬)의 제작과 평가

)문철희(Cheol-Hee Moon) 호서대학교 공업기술연구소 2006 공업기술연구 논문집 Vol.25 No.1

3 inch PDP (Plasma Display Panel) was manufactured using the laboratory facilities. To overcome the glass breakage problem during the sealing process, the sealing facility was reformed. Paste filtering facilities was introduced to reduce the defect level during the printing process. Electrical and optical properties was evaluated by the measuring system which has been built up for the laboratory.

OLED 밀봉을 위한 실링기술 개발

문철희(Cheol - Hee Moon) 호서대학교 공업기술연구소 2013 공업기술연구 논문집 Vol.32 No.2

최근 디스플레이 산업에서 가장 큰 이슈인 ᄋLED 디바이스의 본격적인 상용화를 위해서는 유기물질을 손상시 키지 않는 저온에서 수분과 산소의 투과를 완벽히 막을 수 있는 실링라인을 구현하는 것이 관건이다, 본 실험에서는 저융점금속(LMPA: Low Melting Point Alloy)을 이용하여 다양한 방법으로 이러한 접합특성을 가진 실링 라인을 얻을 수 있도록 실험하였다. 실링라인만 부분적으로 가열하는 방법과 디바이스 전체를 저온에서 가열하는두 가지 방법으로 실험하였는데, 후자의 경우 Sn-Bi 합금과 에폭시의 흔합재료를 이용하여 150 °C 이하의 저온에서 실링라인을 제작하였고 ᄋLED 실링라인으로 활용할 수 있는 가능성을 확인하였다. In a recent display industry, for the commercialization o f the O LED devices, sealing technology to get a sealing line to guarantee the barrier characteristics against the permeation o f moisture and oxygen from the outside without resulting in a damage for the organic materials in a device is a keypoint. In tms study, various types o f expiriments using LM PA (Low M elting Point Alloy) have been conducted including a local heating o f sealing line and low temperature heating for overal device. For the latter case, sealing line was made o f the mixture o f Sn-Bi alloy and epoxy and annealed under 150 °C, in which a possibility as a O LED sealing line was confirmed.

Al-Cu-Mg 합금의 일방향응고시 로온도에 따른 응고거동변화

문철희 ( Cheol Hee Moon ) 한국주조공학회 1997 한국주조공학회지 Vol.17 No.6

N/A 14 ㎝ length Al-15Cu-1Mg alloys have been directionally solidified in 3 mm diameter alumina tubes in a furnace moved with a constant velocity V=12 ㎝/hr under various furnace temperatures of 660, 710 and 760˚C. By analysing the evolution of the temperature profiles along the alloy length during the solidification, the growth characteristics such as the position of the solid/liquid interface, the local growth velocity (R) and the temperature gradient at the solid/liquid interface (G) have been determined. The effects of the furnace temperature on the growth behavior have been investigated by the comparison of R and G values for each temperature. Under the furnace temperature of 760˚C, steady state growth region was observed for the latter half of the growth period. (Received October 23, 1997)

전자기 방식의 에너지 하데스팅 소자를 이용한 살균모듈

문철희(Cheol- Hee Moon) 호서대학교 공업기술연구소 2016 공업기술연구 논문집 Vol.35 No.1

수영장과 같은 대형시설에서부터 세탁기와 같은 소형 가전제품까지 다양한 분야에서 살균모듈의 중요성이 점점 부각되고 있다 . 본 연구에서는 에너지 하베스팅 소자를 이용하여 별도의 외부전원공급 없이 전자기 방식에 의해 전류를 발생하며 이를 이용하여 u v LED를 점등하여 살균하는 기술에 대하여 다루었다 . 실험변수로는 모듈의 크기 , 전자기 디바이스의 구성방법 , 코일의 직경 , 코일의 턴 수 등을 달리하여 UV LED를 점등하였다 . 그 결과 원통 형의 코일을 사용한 실험에서 코일의 감는 횟수가 7.500회인 경우 가장 높은 에너지인 32 mW의 값을 얻을 수 있었다 . The importance or the sterilization modules is increasing for various applications such as swimming doo I and washing machine. In this study, we designed energy harvesting device to get a required electrical power without power supply from outside. As an experimental factors, the size of the module, design of the electromagnetic devices, diameter and turns of the coils were varied and optimized. In the expiriments using cylindrical coil fixture with 7,500 turns, the mghest value of 32 mW was obtained.

LED 패키지에서 봉지재가 광추출 효율에 미치는 영향

최현수(Hyun -Su Choi),문철희(Cheol-Hee Moon) 호서대학교 공업기술연구소 2014 공업기술연구 논문집 Vol.33 No.1

LED 패키지에서 봉지재가 광추출 효율에 미치는 영향을 파악하기 위하여 실험과 Iighttods를 활용한 시물레이션 방법을 이용하여 연구를 진행하였다. 봉지재의 굴절률은 1.41 과 1.53을 비교하였고는 봉지재는 평평한 형태로 주입하여 두께가 0.7,1.4,2.1, 2.8 mm인 패키지를 제작하였다. 적분구를 이용하여 광속을 측정한 결과 굴절률이 1.41 인 경우가 1.53인 경우보다 광속이 다소 높은 것으로 측정되었다. 이는 시물레이션 결과와도 일치하였는데,Iighttods을 이용하여 분석한 결과 LED 침에서 봉지재로 추출되는 효율은 굴절률이 1.53인 경우가 높지만, 봉지재에서 공기 중으로 추출되는 효율은 굴절률이 1.41 인 경우가 높기 때문인 것으로 해석되었다. Effects of the encapsulant on the light extraction efficiency of LED package was investigated bv exp^iment and simulation work using Iighttods. Encapsulants with a refractive index of 1.41 and 1.53 were compared and the thickness of the flat type oicapsulants was varied as 0.7, 1.4, 2.1,2.8 mm. We measured the luminous flux of tbe package with an integral sphere, wiiich was higher wtei the refractive index was 1.41 than 1.53. The analysis using the Iighttods showed that tbe light extraction efficiency at the interface between the chip and the encapsulant was higher when the refractive index was 1.53. However, the light extraction efficiency at the interface between the encapsulant and the air was higgler when the refractive index was 1.41,wbich is why we obtained a higher luminous flux for refractive index of 1.41.

유한체적법(FVM)의 시뮬레이션을 활용한 LED 벌브의 열 특성 고찰

박경민(Kyoung-Min Park),문철희(Cheol-Hee Moon) 한국조명·전기설비학회 2014 조명·전기설비학회논문지 Vol.28 No.10

Heat dissipation of the high power LED is a critical issue. To estimate the junction temperature of the LED chip is most important in characterizing the heat dissipation, but it is impossible to directly measure it. In this study, surface temperatures of the 12.8W LED bulb was measured for 5 points using a data logger and compared with the simulated results using a thermal simulator based on FVM (finite volume method) to secure a reliability of the simulation. Effects of some factors such as lens, emissivity and air inlet were investigated using simulation works and then the results were analysed.

LED 패키지에서 MPCB 온도에 따른 방열특성의 변화

김병호 ( Byung Ho Kim ),문철희 ( Cheol Hee Moon ) 대한금속재료학회(구 대한금속학회) 2013 대한금속·재료학회지 Vol.51 No.9

The temperature of the MPCB of a 16-chip LED package (TB) was kept at 25℃, 50℃ and 75℃ using a Peltier element and compared with natural cooling conditions. The junction temperature (TJ) was measured by a thermal transient method. A heat transfer model is proposed to investigate the heat flux through the three heat dissipation paths, upward, sideward and downward, and to predict the temperature distribution inside the LED package. The results showed that, with 4.8 W of input power applied, TJ decreased dramatically from 115℃ to 38℃ by keeping TB at 25℃ due to the elimination of the heat convection resistance at the MPCB surface. It was predicted that a maximum of 28 W could be applied to the package by keeping TB at 25℃ under the constraint condition that the junction temperature of the LED not exceed 100℃.