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칩과 패키지 사이의 연결선이 패키지 안에 삽입된 인덕터의 성능에 미치는 영향
당신트롱,윤상웅 경희대학교 경희정보통신 SoC연구소 2008 경희정보통신SOC연구소 논문집 Vol.9 No.-
The interconnection effect between chip and package on the characteristics of an embedded inductor ispresented in this paper. The embedded inductor in a Fine Ball Grid Array (FBGA) multi-layer package shows the maximum Quality (Q)-factor of 40 at 3.5GHz and the Self-Resonance Frequency (SRF) around 8.5GHz. However, when the parasitic components resulted from interconnection between the embedded inductors and the pads on RFICs are included, the Q-factor is reduced by maximum 25% and the self-resonance frequency by maximum 40%. The work in this paper informs that the chip-to-package interconnection limits the maximum quality and usable frequency range of an embedded inductor in a package.