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RISS 인기검색어
- 검색키워드
- 저자 : Srikrishna (검색결과 9 건)
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Miniaturized Bandpass Filters as Ultrathin 3-D IPDs and Embedded Thinfilms in 3-D Glass Modules
Sitaraman, Srikrishna,Sukumaran, Vijay,Pulugurtha, Markondeya Raj,Zihan Wu,Suzuki, Yuya,Youngwoo Kim,Sundaram, Venky,Joungho Kim,Tummala, Rao R. IEEE 2017 IEEE transactions on components, packaging, and ma Vol.7 No.9
<P>This paper presents the modeling, design, fabrication, and characterization of an innovative and miniaturized thin-film bandpass filter with coupled spiral structures in ultrathin glass substrates (30-100 mu m). This filter is demonstrated for two applications: 3-D integrated passive devices and embedded thinfilm filters in RF modules. A compact filter design was achieved through an integrated resonant structure that effectively utilizes the inductive and capacitive coupling between metal layers on either side of an ultrathin glass substrate or organic build-up layer. The designed filters (layout area <1 mm 2 with 80-150 mu m device thickness) were fabricated on a 30-mu m-thin glass substrate using a panel-based low-cost approach with double-side thin-film wiring processes. The effect of process variations on the performance of the proposed structures was also studied. Furthermore, an improved WLAN filter is designed and demonstrated by employing specific structural modifications. The measured frequency response of the filters shows good model-to-hardware correlation, with very low insertion loss (0.6 dB) in the passband, and high adjacent-band rejection (>25 dB).</P>
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Kumar, Gokul,Sitaraman, Srikrishna,Jonghyun Cho,Sundaram, Venky,Joungho Kim,Tummala, Rao R. IEEE 2016 IEEE transactions on components, packaging, and ma Vol.6 No.1
<P>Ultrathin 3-D glass interposers with throughpackage vias at the same pitch as through-silicon vias (TSVs) have been proposed as a simpler and cheaper alternative to the direct 3-D stacking of logic and memory devices. Such 3-D interposers provide wide-I/O channels for high signal bandwidth (BW) between the logic device on one side of the interposer and memory stack on the other side, without the use of complex TSVs in the logic die. However, this configuration introduces power delivery design challenges due to resonance from: 1) the low-loss property of the glass substrate and 2) the parasitic inductance due to additional length from lateral power delivery path. This paper presents for the first time, the design and demonstration of power delivery networks (PDNs) in 30-μm thin, 3-D double-sided glass interposers, by suppressing the noise from mode resonances. The self-impedance of the 3-D glass interposer PDN was simulated using electromagnetic solvers, including printed-wiring-board and chip-level models. The 3-D PDN was compared with that of the 2-D glass packages having fully populated ball grid array connections. The resonance mechanism for each configuration was studied in detail, and the corresponding PDN loop inductances were evaluated. High impedance peaks in addition to the 2-D PDN were observed at high frequencies (near 7.3 GHz) in the 3-D interposer structure due to the increased inductances from lateral power delivery. This paper proposes and evaluates three important resonance suppression techniques based on: 1) 3-D interposer die configuration; 2) the selection and placement of decoupling capacitors; and 3) 3-D interposer package power and ground stack-up. Two-metal and four-metal layer test vehicles were fabricated on 30and 100-μm thick panel-based glass substrates, respectively, to validate the modeling and analysis of the proposed approach. The PDN test structures were characterized up to 20 GHz for plane resonances and network impedances, with good model-to-hardware correlation. The results in this paper suggest that the ultrathin 3-D interposer PDN structure can be effectively designed to meet the target impedance guidelines for high-BW applications, providing a compelling alternative to 3-D-IC stacking with the TSVs.</P>
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Panda, Rajmohan,Mathur, Manu Raj,Divya, Persai,Srivastava, Swati,Ramachandra, Srikrishna Sulgodu Asian Pacific Journal of Cancer Prevention 2012 Asian Pacific journal of cancer prevention Vol.13 No.12
Introduction: Andhra Pradesh (AP) is one of the largest tobacco producing states in India. About 29% of adults in AP currently use tobacco in some form. Almost 24% of males and 4% of females are smokers. The prevalence of tobacco use in the state is higher than the national average of 15% for male and 2% for female smokers. However, few attempts have been made to understand the current situation of tobacco control resources, activities and strategies in the context of such a high tobacco prevalence state. The present study aimed to identify the gaps in existing tobacco control program and areas where tobacco control efforts can be integrated. Methods: Data were collected using both quantitative and qualitative methods. Semi-structured interviews were undertaken with a total of 95 key officials of state health departments, program managers, and project directors in six districts to understand ongoing tobacco control efforts. To facilitate the interviews, semi-structured guides were developed. Simple descriptive statistical analysis was conducted on the quantitative data using SPSS version 17. Results: The results of the situational analysis suggest that a sufficient health workforce and infrastructure with the potential to integrate tobacco control activities is available in the surveyed districts. However, lack of integration of the tobacco control program intothe tuberculosis control program and the National Rural Health Mission was observed. Information, education and communication activities were lacking at block level health facilities. Conclusions: Our findings indicate that lack of trained health professionals, paucity of dedicated funds, lack of information, education and communication materials and low priority given to tobacco control activities are some of the factors which impede integration of tobacco control into existing health and developmental programmes in the districts of Andhra Pradesh, India.
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Mechanical and fracture properties of glass fiber reinforced geopolymer concrete
Midhuna, M.S.,Gunneswara Rao, T.D.,Chaitanya Srikrishna, T. Techno-Press 2018 Advances in concrete construction Vol.6 No.1
This paper investigates the effect of inclusion of glass fibers on mechanical and fracture properties of binary blend geopolymer concrete produced by using fly ash and ground granulated blast furnace slag. To study the effect of glass fibers, the mix design parameters like binder content, alkaline solution/binder ratio, sodium hydroxide concentration and aggregate grading were kept constant. Four different volume fractions (0.1%, 0.2%, 0.3% and 0.4%) and two different lengths (6 mm, 13 mm) of glass fibers were considered in the present study. Three different notch-depth ratios (0.1, 0.2, and 0.3) were considered for determining the fracture properties. The test results indicated that the addition of glass fibers improved the flexural strength, split tensile strength, fracture energy, critical stress intensity factor and critical crack mouth opening displacement of geopolymer concrete. 13 mm fibers are found to be more effective than 6 mm fibers and the optimum dosage of glass fibers was found to be 0.3% (by volume of concrete). The study shows the enormous potential of glass fiber reinforced geopolymer concrete in structural applications.
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Kim, Youngwoo,Cho, Jonghyun,Kim, Jonghoon J.,Cho, Kyungjun,Kim, Subin,Sitaraman, Srikrishna,Sundaram, Venky,Raj, Pulugurtha Markondeya,Tummala, Rao R.,Kim, Joungho [Institute of Electrical and Electronics Engineers 2017 IEEE transactions on electromagnetic compatibility Vol.59 No.3
<P>In this paper, we propose glass interposer electromagnetic bandgap (EBG) structure to efficiently suppress power/ground noise coupling. We designed, fabricated, measured, and analyzed a glass interposer EBG structure for the first time. Glass interposer EBG structure test vehicles were fabricated using a thin-glass substrate, low-loss polymer layers, and periodic metal patches with through glass vias (TGVs) in glass interposer power distribution network. Using the dispersion characteristics, we thoroughly analyzed and derived f(L) and f(U) of the glass interposer EBG structure. We experimentally verified that the proposed glass interposer EBG structure achieved power/ground noise suppression (below -40 dB) between f(L) of 5.8 GHz and f(U) of 9.6 GHz. Derived f(L) and f(U) based on dispersion analysis, full three-dimensional electromagnetic (3-D-EM) simulation and measurement achieved good correlation. In the glass interposer EBG structure, tapered structure of the TGV and thickness of the low-loss polymer used for metal-layers lamination affected the noise suppression bandgap significantly. The effectiveness of the proposed glass interposer EBG structure on suppression of the power/ground noise propagation and coupling to high-speed TGV channel was verified with 3-D-EM simulation. As a result, the proposed glass interposer EBG structure successfully and efficiently suppressed the power/ground noise propagation and improved eye-diagram of the high-speed TGV channel.</P>
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Paul, Shatabdi,Solanki, Prem Prakash,Shahi, Uday Pratap,Srikrishna, Saripella Asian Pacific Journal of Cancer Prevention 2015 Asian Pacific journal of cancer prevention Vol.16 No.18
Background: Breast cancer is the second most cause of death (1.38 million, 10.9% of all cancer) worldwide after lung cancer. In present study, we assess the knowledge, level of awareness of risk factors and screening practices especially breast self examination (BSE) among women, considering the non-feasibility of diagnostic tools such as mammography for breast screening techniques of breast cancer in the holy city Varanasi, Uttar Pradesh, India. Materials and Methods: A cross-sectional population based survey was conducted. The investigation tool adopted was self administrated questionnaire format. Data were analysed using SPSS 20 version and Chi square test to determine significant association between various education groups with awareness and knowledge, analysis of variance was applied in order to establish significance. Results: The attitude of participants in this study, among 560 women 500 (89%) responded (age group 18-65 years), 53.8% were married. The knowledge about BSE was very low (16%) and out of them 15.6% were practised BSE only once in life time. study shown that prominent age at which women achieve their parity was 20 yrs, among 500 participants 224 women have achieved their parity from age 18 to 30 yrs. Very well known awareness about risk factors of breast cancer were alcohol (64.6%), smoking (64%) and least known awareness risk factors were early menarche (17.2%) and use of red meat (23%). The recovery factors of breast cancer cases were doctors support (95%) and family support (94.5%) as most familiar responses of the holy city Varanasi. Conclusions: The study revealed that the awareness about risk factors and practised of BSE among women in Varanasi is extremely low in comparison with other cities and countries as well (Delhi, Mumbai, Himachal Pradesh, Turkey and Nigeria). However, doctors and health workers may promote the early diagnosis of breast cancer.
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Youngwoo Kim,Jonghyun Cho,Kyungjun Cho,Junyong Park,Subin Kim,Dong-Hyun Kim,Gapyeol Park,Sitaraman, Srikrishna,Raj, Pulugurtha Markondeya,Tummala, Rao R.,Joungho Kim IEEE 2017 IEEE transactions on components, packaging, and ma Vol.7 No.9
<P>In this paper, we propose glass-interposer (GI) electromagnetic bandgap (EBG) structure with defected ground plane (DGP) for efficient and broadband suppression of power/ground noise coupling. We designed, fabricated, measured, and analyzed a GI-EBG structure with DGP for the first time. The proposed GI-EBG structure with DGP is thoroughly analyzed using the dispersion characteristics and estimated stopband edges, f(L) and f(U). We experimentally verified that the proposed GI-EBG structure with DGP achieved power/ground noise isolation bandgap (below -30 dB) between f(L) of 5.7 GHz and f(U) of 11 GHz. Estimation of f(L) and f(U) using dispersion analysis, full 3-D electromagnetic (EM) simulation results, and measurement results achieved good correlation. Effectiveness of the proposed GI-EBG structure with DGP on suppression of the power/ground noise coupling to high-speed through glass via (TGV) channel is verified with 3-D EM simulation. As a result, the proposed EBG structure successfully and efficiently suppressed the power/ground noise coupling and improved the eye diagram of the TGV channel. Lastly, we embedded thin alumina film in the proposed EBG structure and achieved even broader power/ground noise suppression between 2.1 and 14.7 GHz.</P>
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