http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
Mounting Uncased Multi-connection Integrated Circuits with Ball Contacts on Flexible Polyimide Board
Yu. Dolgovykh,A. Pogalov,G. Blinov,S. Timoshenkov,N. Korobova 한국정보통신학회 2014 2016 INTERNATIONAL CONFERENCE Vol.6 No.1
One of the modern design and technological solutions for micro-miniaturization of electronic products is the development of multichip modules based on the technology of assembly and installation unpackaged chips on a flexible board. Technology of uncased multi-connection integrated circuits (ICs) creating with ball contacts was propose. Ball contacts were formed on the contact areas of the crystal. Crystal after certification was mounted on a flexible circuit, where hemispherical contact pads have been formed