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김중강,신무진,류태선,오춘석,김덕준 啓明大學校 醫科大學 1994 계명의대학술지 Vol.13 No.4
Choanal polyps can be defined as paranasal sinus polyps that pass through sinus ostia and protrude into the boundary between the nasal cavity and nasopharynx-the choana. The most common choanal polyp is the antrochoanal polyp, but sphenochoanal and ethmoidochoanal polyps are rarer. We experienced a case of choanal polyp originating from the nasal mucosa of the sphenoethmoid recess, not from the paranasal sinuses. It was removed with intranasal endoscopy, and 6 months follow-up has not shown any recurrence. So we report this very rare case with review of literatures.
Throughput Analysis for Dual Blade Robot Cluster Tool
Sun Joong Ryu(유선중) 제어로봇시스템학회 2009 제어·로봇·시스템학회 논문지 Vol.15 No.12
The throughput characteristics of the cluster tool with dual blade robot are analyzed. Using equipment’s cycle time chart of the equipment, simple analytic form of the throughput is derived. Then, several important throughput characteristics are analyzed by the throughput formula. First, utilization of the process chamber and the robot are maximized by assigning the equipment to the process whose processing time is near the critical process time. Second, rule for selecting optimal number of process chambers is suggested. It is desirable to select a single process chamber plus a single robot structure for relatively short time process and multi process chambers plus a single robot, namely cluster tool for relatively long time process. Third, throughput variation between equipments due to the wafer transfer time variation is analyzed, especially for the process whose processing time is less than critical process time. And the throughput and the wafer transfer time of the equipments in our fabrication line are measured and compared to the analysis.
유선중(Sun Joong Ryu) Korean Society for Precision Engineering 2009 한국정밀공학회지 Vol.26 No.11
Alignment error of the BGA lithography equipment is mainly caused by the dimensional change of the BGA panel which is generated during the manufacturing processes. To minimize the alignment error, ‘mark alignment’ algorithm in place of ‘center alignment’ algorithm was proposed and the optimal solution for the algorithm was derived by simple analytic form. The developed algorithm distributes evenly the alignment error over the whole panel which was evaluated by the numerical simulation. Finally, the developed algorithm was implemented to the controller of the lithography equipment and the alignment error was measured at the fiducial mark location. From the measurement, it is also concluded that the developed alignment algorithm be effective to reduce the maximum value of alignment error.
유선중(Sun-Joong Ryu) 한국가스학회 2015 한국가스학회지 Vol.19 No.2
외관검사공정의 성능을 개선하기 위하여 기존의 자동외관검사장비 및 인간검사원에 추가하여 새로이 나이브 베이즈 분류기를 이용한 공정 구성을 개발하였다. 나이브 베이즈 분류기를 공정에 적용함으로써 불량의 유출 및 인간검사원의 작업량을 동시에 개선할 수 있다. 이때 분류기의 판정기준으로 기존의 MAP 방법 대신 AMPB 방법을 제안하여 적용하였다. 카메라모듈 용 필터 제품을 이용한 실험 결과 유출율 1.14%, 인간검사원 작업량 비율 75.5% 수준에서 공정을 구성하는 것이 가능함을 확인할 수 있었다. 본 연구의 결과는 검사 장비 및 인간이 협업을 하여 수행하는 타 공정 ? 가스 누출 탐지 ? 등에도 적용될 수 있다는 것에 넓은 범위에서의 의의가 있다. In order to improve the performance of the visual inspection process, in addition to existing automatic visual inspection machine and human inspectors have developed a new process configuration using a Naive Bayes classifier. By applying the classifier, defect leakage and human inspector’s work amount could be improved at the same time. New classification method called AMPB was applied instead of conventional methods based on MAP classification. By experimental results using the filter product for camera modules, it was confirmed that it is possible to configure the process at the level of leakage ratio 1.14% and human inspector’s work amount ratio 75.5%. It is significant that the result can be applied in such a wide range as gas leak detection which is the collaboration process between inspection machine and human inspector’s
유선중(Sun Joong Ryu),허준연(JunYeon Heo),조승현(Seunghyun Cho) Korean Society for Precision Engineering 2011 한국정밀공학회지 Vol.28 No.2
Clamp type transferring mechanism for package substrate's wet processes was newly developed instead of conventional roller type transferring mechanism. Clamp type transferring mechanism has the advantages of reducing the panel deflection and of minimizing the contact problem between the panel and the transferring mechanism. Individual clamp of the mechanism has two distinct mechanical functions which are perfectly fixing a panel during the transferring and generating adequate tension for the panel. To determine the mechanical parameters of the clamp, panel deflection simulation was conducted and the result was verified by the panel deflection measurement. Also, fixing angle of a clamp could be determined by the free body force analysis of individual clamp. Finally clamp type transferring mechanism was actually manufactured and the transferring performance was verified during the water spraying condition of the package substrate's wet processes.
Three-phase Making Test Method for Common Type Circuit Breaker
Ryu, Jung-Hyeon,Choi, Ike-Sun,Kim, Kern-Joong The Korean Institute of Electrical Engineers 2012 Journal of Electrical Engineering & Technology Vol.7 No.5
The synthetic short-circuit making test to adequately stress the circuit breaker has been specified as the mandatory test duty in the IEC 62271-100. The purpose of this test is to give the maximum pre-arcing energy during making operation. And this requires the making operation with symmetrical short-circuit current that is established when the breakdown between contact gap occurs near the crest of the applied voltage. Also, if the interrupting chamber of circuit breakers is designed as the type of common enclosure or the operation is made by the gang operated mechanism that three-phase contacts are operated by one common mechanism, three-phase synthetic making test is basically required. Therefore, several testing laboratories have developed and proposed their own test circuits to properly evaluate the breaker performance. With these technical backgrounds, we have developed the new alternative three-phase making circuit.
Ryu, Hyun-Seung,Hong, Kug Sun,Lee, Jung-Kun,Kim, Deug Joong Cambridge University Press (Materials Research Soc 2006 Journal of materials research Vol.21 No.2
<P>The phase evolution of magnesium incorporated hydroxyapatite/β-tricalcium phosphate (HA/β-TCP) ceramics of high purity prepared by solid-state reaction was investigated with the aid of x-ray diffraction and infrared spectroscopy (IR) in transmittance mode analysis. The dependence of the microstructure on the phase evolution of biphasic ceramics during natural sintering was also investigated as a function of Mg content. When sintered at 1100 °C, Mg is preferentially incorporated into the β-TCP phase rather than the HA phase. This Mg incorporation into the β-TCP effectively suppresses the phase transition from β- to α-TCP. With increasing sintering temperature, the solubility limit of the Mg in the β-TCP decreases and Mg starts to be either incorporated into the HA phase or segregated as free MgO. The decreased Mg content in the β-TCP facilitates the phase transition from β- into α-TCP, at 1300 °C or higher. Different processing methods on Mg addition show that the retarded phase transition from β- to α-TCP is the inherent property of Mg-doped HA/TCP. The variations in processing parameters mainly affect the microstructure instead of the phase evolution, leading to highly densified HA/β-TCP ceramics.</P>