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안승호,최춘기,한상필,Myung-YungJeong 한국전자통신연구원 2003 ETRI Journal Vol.25 No.4
Polymeric multi-channel optical interconnection devices that are usually fabricated by transfer molding are indispensable for parallel interconnection in high speed, high capacity optical communication systems. This paper proposes a design technique considering the thermal behavior of materials, such as shrinkage and expansion during the molding process, to satisfy geometrical requirements that have less than 1 μm tolerance. We also designed molds considering the thermal effects of the materials and fabricated multichannel optical fiber connectors that have less than 1 μm tolerance.