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RISS 인기검색어
- 검색키워드
- 저자 : Markus J. Buehler (검색결과 2 건)
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Molecular architecture of collagen fibrils: A critical length scale for tough fibrils
Markus J. Buehler 한국물리학회 2008 Current Applied Physics Vol.8 No.3,4
Protein materials constitute Nature’s most intriguing material concepts, leading to multi-functional and stimuli responsive materials. Such materials often feature a characteristic hierarchical design, which is characterized by structural features starting at nanoscale. Here we review recent studies of deformation of collagen, Nature’s most abundant structural protein material forming the basis of bone, tendon and skin. We have discovered that a specific nanostructural design with molecular lengths of 200 nm leads to the strongest possible ultra-structure that is still capable of dissipating large amounts of energy before fracture occurs, maximizing the toughness of the material [M.J. Buehler, Proceedings of the National Academy of Sciences USA 103 (2006) 12285]. The analysis explains prevalent molecular length scales observed in tendon, bone and the eye’s cornea, and explains how molecular properties influence the deformation and fracture mechanics of tissues. Protein materials constitute Nature’s most intriguing material concepts, leading to multi-functional and stimuli responsive materials. Such materials often feature a characteristic hierarchical design, which is characterized by structural features starting at nanoscale. Here we review recent studies of deformation of collagen, Nature’s most abundant structural protein material forming the basis of bone, tendon and skin. We have discovered that a specific nanostructural design with molecular lengths of 200 nm leads to the strongest possible ultra-structure that is still capable of dissipating large amounts of energy before fracture occurs, maximizing the toughness of the material [M.J. Buehler, Proceedings of the National Academy of Sciences USA 103 (2006) 12285]. The analysis explains prevalent molecular length scales observed in tendon, bone and the eye’s cornea, and explains how molecular properties influence the deformation and fracture mechanics of tissues.
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Reversible MoS<sub>2</sub> Origami with Spatially Resolved and Reconfigurable Photosensitivity
Xu, Weinan,Li, Tengfei,Qin, Zhao,Huang, Qi,Gao, Hui,Kang, Kibum,Park, Jiwoong,Buehler, Markus J.,Khurgin, Jacob B.,Gracias, David H. American Chemical Society 2019 Nano letters Vol.19 No.11
<P>Two-dimensional layered materials (2DLMs) have been extensively studied in a variety of planar optoelectronic devices. Three-dimensional (3D) optoelectronic structures offer unique advantages including omnidirectional responses, multipolar detection, and enhanced light-matter interactions. However, there has been limited success in transforming monolayer 2DLMs into reconfigurable 3D optoelectronic devices due to challenges in microfabrication and integration of these materials in truly 3D geometries. Here, we report an origami-inspired self-folding approach to reversibly transform monolayer molybdenum disulfide (MoS<SUB>2</SUB>) into functional 3D optoelectronic devices. We pattern and integrate monolayer MoS<SUB>2</SUB> and gold (Au) onto differentially photo-cross-linked thin polymer (SU8) films. The devices reversibly self-fold due to swelling gradients in the SU8 films upon solvent exchange. We fabricate a wide variety of optically active 3D MoS<SUB>2</SUB> microstructures including pyramids, cubes, flowers, dodecahedra, and Miura-oris, and we simulate the self-folding mechanism using a coarse-grained mechanics model. Using finite-difference time-domain (FDTD) simulation and optoelectronic characterization, we demonstrate that the 3D self-folded MoS<SUB>2</SUB> structures show enhanced light interaction and are capable of angle-resolved photodetection. Importantly, the structures are also reversibly reconfigurable upon solvent exchange with high tunability in the optical detection area. Our approach provides a versatile strategy to reversibly configure 2D materials in 3D optoelectronic devices of broad relevance to flexible and wearable electronics, biosensing, and robotics.</P> [FIG OMISSION]</BR>
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