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지성근,Lim, Sung Ryun,정동언,우준환 한국마이크로전자및패키징학회 1998 International Symposium on Microelectronics and Pa Vol.1 No.1
This piper illustrates that LGIC developed UDCD MCM(Multi Chip Module) as the core device of our WLL system by the combination of Fodel process which use photoimaging technalogies for the multilayer process and Thin film process evith the excellent RF characteristics and the various application at assembly and packaging selectivity. The features of the module consist of Fodel and thin film technologies which have 3 metal layers with 70un/1.00um line/spaces and 125urn/200um via/through hole diameters. Considering CTE matching with alumina ceramic substrates, we applied ceramic lid and B-stage process. to module packaging. We also generated high density MCM with good assemblability and reliability, which was miniaturized by 87% than conventional PCB application and expected to reduce the cost about 45% to MCM-D process