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Cu/CuO/Polyimide 시스템의 접착 및 계면화학 반응
이경운,채홍철,최철민,김명한,Lee, K.W.,Chae, H.C.,Choi, C.M.,Kim, M.H. 한국재료학회 2007 한국재료학회지 Vol.17 No.2
The magnetron reactive sputtering was adopted to deposit CuO buffer layers on the polyimide surfaces for increasing the adhesion strength between Cu thin films and polyimide, varying $O_2$ gas flow rate from 1 to 5 sccm. The CuO oxide was formed through all the $O_2$ gas flow rates of 1 to 5 sccm, showing the highest value at the 3 sccm $O_2$ gas flow rate. The XPS analysis revealed that the $Cu_2O$ oxide was also formed with a significant ratio during the reactive sputtering. The adhesion strength is mainly dependent on the amount of CuO in the buffer layers, which can react with C-O-C or C-N bonds on the polyimide surfaces. The adhesion strength of the multi-layered Cu/buffer layer/polyimide specimen decreased linearly as the heating temperature increased to $300^{\circ}C$, even though there showd no significant change in the chemical state at the polyimide interface. This result is attributed to the decrease in surface roughness of deposited copper oxide on the polyimide, when it is heated.
스크린 플라즈마 질화법에 의해 처리된 STS316L 강 표면의 질화층에 관한 연구
채홍철, 홍주화 충북대학교 산업과학기술연구소 2013 산업과학기술연구 논문집 Vol.27 No.2
Screen plasma nitrided surface layer of STS316L stainless steel was studied by AES and in-situ XPS. The nitriding treatment was done using ultra high purity nitrogen gas under workpiece temperature range from R.T. to 600℃. Nitride layer composition was uniform, thickness was about 1 um and thin nitrogen penetration was attributed to zero bias of workpiece in this screen plasma method. It was confirmed that oxygen present on sample surface reacted with nitrogen gas forming NOx, and this acted as a passive film interfering nitride formation. Increasing sample temperature promoted CrN and Cr2N formation, reducing NO and NO2, and accordingly maximum thickness of CrN phase was achieved at 600℃. Nano-indentation hardness of nitride layer, measured up to depth of 500nm from surface, showed a high value of exceeding 11GPa, when processed at 600℃.