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음푸른별(Pu-Reun-Byul Eum),예인수(In-Soo Ye),류창국(Changkook Ryu),문지홍(Ji Hong Moon),방병열(Byung Ryeol Bang),이은도(Uen Do Lee) 한국연소학회 2010 KOSCOSYMPOSIUM논문집 Vol.- No.40
Pyrolysis thermally decomposes lignocellulosic materials into tar vapor and gases leaving the carbonaceous solid residue (char). Although numerous studies have been reported for this key process of biomass thermal conversion, pyrolysis remains as the most complicated phenomena due to the complexity associated with the structural changes, a large number of compounds generated and their secondary reactions. One difficulty in biomass studies is the gap between the analytical characterization using a thermogravimetric analyzer (TGA) and pyrolysis of actual large particles. This paper reports a preliminary study on the effect of particle size in pyrolysis using wood pellets. The pyrolytic mass loss curve from a TGA with fine sawdust and a thermobalance with large pellets were compared, and the difference was discussed using prediction of heat transfer rates. Further study is required on detailed product characterization including the tar and gases for various particle sizes.
바이오매스 가스화시 타르의 열적 분해 및 촤의 영향에 대한 실험적 연구
음푸른별(Pu-Reun-Byul Eum),이용운(Yongwoon Lee),류창국(Changkook Ryu),박영권(Young-Kwon Park) 한국연소학회 2011 KOSCOSYMPOSIUM논문집 Vol.- No.43
Formation of tar and its cracking are the most complicated phenomena during pyrolysis and gasification of biomass. This study investigated the decomposition of tar from wood by thermal cracking and catalytic cracking on the char surface. Firstly, wood was pyrolyzed at 500℃ and analyzed for its tar composition. Then, the pyrolysis vapor was passed through a reactor filled with or without char at temperatures of 600, 700 or 800℃. The gas and condensable products were analyzed for compound and elemental composition. The results showed that the thermal cracking of tar became very active at 800℃ and the presence of small char particles greatly enhanced the tar reduction by active catalytic effect of char. This can be applied to minimize the tar concentration in a fixed bed gasifier.
반도체 테스트 장비의 발열 부위에서 방열판 효과의 열전달 해석
음푸른별(Pu-Reun-Byul Eum),안지은(Ji Eun An),김인한(In Han Kim),김용운(Yong Woon Kim) 대한기계학회 2015 대한기계학회 춘추학술대회 Vol.2015 No.11
Final test in semiconductor manufacturing process is a very important step for quality control and cost reduction. The heat generated by the FOB (Fan Out Buffer) chips which is attached on the bottom side of socket board in the semiconductor test equipment causes target testing semiconductor’s temperature increasing and sometimes test equipment shutting down. Moreover, it makes confusing on deciding pass or fail. These problems would be the reasons of increasing test time and cost in semiconductor test process. One way to improve these phenomena is attaching a heat sink to the heating area. This study is about prediction of the effects by heat sink attachment using Computational Fluid Dynamics (CFD) and calculation of decreasing device temperature (target testing semiconductor) once heat sink is attached to the heat area.
반도체 검사 장비의 ASIC 및 Socket board의 열전달 해석
음푸른별(Pu-Reun-Byul Eum),안지은(Ji Eun An),이재상(Jae Sang Lee),윤현식(Hyun Sik Yoon),이인표(In Pyo Lee),정세환(Se Hwan Jung),김용운(Yong Woon Kim) 대한기계학회 2014 대한기계학회 춘추학술대회 Vol.2014 No.11
Final inspection in semiconductor manufacturing process is a very important step for quality control and cost reduction. The inspection often includes environmental tests, and the heat release from the inspection equipment may sometimes lead to misjudgment. This study investigates the heat release and transfer of ASIC board and socket board used in the inspection process using computational fluid dynamics. The heat transfer characteristics for different configurations of the equipment were discussed to derive considerations to improve its design.