http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
플립칩용 에폭시 접착제의 저온 속경화 거동에 미치는 경화제의 영향
최원정,유세훈,이효수,김목순,김준기,Choi, Won-Jung,Yoo, Se-Hoon,Lee, Hyo-Soo,Kim, Mok-Soon,Kim, Jun-Ki 한국재료학회 2012 한국재료학회지 Vol.22 No.9
Various adhesive materials are used in flip chip packaging for electrical interconnection and structural reinforcement. In cases of COF(chip on film) packages, low temperature bonding adhesive is currently needed for the utilization of low thermal resistance substrate films, such as PEN(polyethylene naphthalate) and PET(polyethylene terephthalate). In this study, the effects of anhydride and dihydrazide hardeners on the low-temperature snap cure behavior of epoxy based non-conductive pastes(NCPs) were investigated to reduce flip chip bonding temperature. Dynamic DSC(differential scanning calorimetry) and isothermal DEA(dielectric analysis) results showed that the curing rate of MHHPA(hexahydro-4-methylphthalic anhydride) at $160^{\circ}C$ was faster than that of ADH(adipic dihydrazide) when considering the onset and peak curing temperatures. In a die shear test performed after flip chip bonding, however, ADH-containing formulations indicated faster trends in reaching saturated bond strength values due to the post curing effect. More enhanced HAST(highly accelerated stress test) reliability could be achieved in an assembly having a higher initial bond strength and, thus, MHHPA is considered to be a more effective hardener than ADH for low temperature snap cure NCPs.
이소정,유세훈,이창우,이지환,김준기,Lee, So-Jeong,Yoo, Se-Hoon,Lee, Chang-Woo,Lee, Ji-Hwan,Kim, Jun-Ki 한국마이크로전자및패키징학회 2009 마이크로전자 및 패키징학회지 Vol.16 No.3
COB(chip-on-board) 플립칩 패키지에 있어서 NCP(non-conductive paste)의 적용성을 확보하기 위해 자체 포뮬레이션한 NCP와 상용 NCP에 대하여 보드레벨 플립칩 패키지를 제작하고 고온고습 및 열충격 신뢰성을 평가하였다. 실험결과 보다 작은 입도의 용융 실리카를 첨가한 NCP 시제품들이 고온고습 신뢰성에 유리한 것을 알 수 있었다. 또한, NCP 접속부에 있어서 열응력에 의한 피로보다 흡습에 의한 에폭시의 팽창이 접속부 파손에 보다큰 영향을 미치는 것으로 나타났으며, NCP의 접착강도가 높을수록 NCP 플립칩 패키지의 열충격 신뢰성이 향상되는 것을 알 수 있었다. High temperature high humidity and thermal shock reliability tests were performed for the board level COB(chip-on-board) flip chip packages using self-formulated and commercial NCPs(non-conductive pastes) to ensure the performance of NCP flip chip packages. It was considered that the more smaller fused silica filler in prototype NCPs is more favorable for high temperature high humidity reliability. The failure of NCP interconnection was affected by the expansion of epoxy due to moisture absorption rather than the fatigue due to thermal stress. It was considered that the NCP having more higher adhesive strength seems to be more favorable to increase the thermal shock reliability.
고용호,유세훈,이창우,Ko, Yong-Ho,Yoo, Se-Hoon,Lee, Chang-Woo 한국마이크로전자및패키징학회 2010 마이크로전자 및 패키징학회지 Vol.17 No.4
본 연구에서는 상용 고온 솔더 중 많이 쓰이고 있는 Sn-3.5Ag, Sn-0.7Cu, Sn-5.0Sb 솔더에 대한 열충격 시험, 열싸이클 시험, 고온 진동 복합 시험 신뢰성 평가를 하였다. 테스트 샘플을 제작하기 위해 Sn-3.5Ag, Sn-0.7Cu, Sn-5.0Sb 솔더볼을 ENIG 표면 처리된 BGA에 접합하였으며, 그 후 BGA샘플을 OSP 표면 처리된 PCB에 실장 하였다. 신뢰성평가 동안 저항변화를 측정하였으며 신뢰성 평가 전후 전단강도 시험을 통하여 접합강도의 변화를 평가하였다. Sn-3.5Ag의 솔더인 경우 전기저항과 접합강도의 저하가 비교 평가한 3가지 솔더 중 가장 높은 저하율을 보였으며 Sn-0.7Cu의 솔더가 신뢰성 평가 후에 비교적 높은 안정성을 나타내었다. In this study, the reliability of thermal shock, thermal cycle, and complex vibration test at high temperature were examined for 3 types of lead-free solder alloys, Sn-3.5Ag, Sn-0.7Cu and Sn-5.0Sb. For the reliability test, daisychained BGA chips with ENIG-finished Cu pad was assembled with the three lead-free solders on OSP-finished PCBs. Among the 3 types solder alloys, Sn-3.5Ag solder alloy showed the highest degradation rate of electrical resistance and joint strength. On the other hand, Sn-0.7Cu solder alloy had high stability after the reliability tests.
Au 스터드 범프 본딩과 Ag 페이스트 본딩으로 연결된 소자의 온도 측정 및 접촉 저항에 관한 연구
김득한,유세훈,이창우,이택영,Kim, Deuk-Han,Yoo, Se-Hoon,Lee, Chang-Woo,Lee, Taek-Yeong 한국마이크로전자및패키징학회 2010 마이크로전자 및 패키징학회지 Vol.17 No.2
탄탈륨실리사이드 히터가 내장된 소자를 Ag 페이스트와 Au SBB(Stud Bump Bonding)를 이용하여 Au가 코팅 된 기판에 각각 접합 하였다. 전단 테스트와 전류를 흐르면서 열 성능을 측정하였다. Au 스터드 범프 본딩의 최적 플립칩 접합조건은 전단 후 파괴면 관찰하여 설정하였으며, 기판 온도를 $350^{\circ}C$, 소자 온도를 $250^{\circ}C$에서 하중을 300 g/bump 로 하여 접합하는 경우가 최적 조건이였다. 히터에 5 W 인가시 소자의 온도는 Ag 페이스트를 이용한 접합의 경우 최대 온도는 약 $50^{\circ}C$이었으며, Au 금속층을 갖고 있는 실리콘 기판에 Au 스터드 본딩으로 접합된 인 경우 약 $64^{\circ}C$를 나타내었다. 기판과의 접촉면적이 와이어본딩과 Au 스터드 범프 본딩 가 약 300배가 차이가 나는 경우 약 $14^{\circ}C$ 차이를 나타내었고, 전사모사를 통하여 접합면의 접촉저항이 중요한 이유임을 알 수 있었다. The device with tantalum silicide heater were bonded by Ag paste and Au SBB(Stud Bump Bonding) onto the Au coated substrate. The shear test after Au ABB and the thermal performance under current stressing were measured. The optimum condition of Au SBB was determined by fractured surface after die shear test and $350^{\circ}C$ for substrate, $250^{\circ}C$ for die during flip chip bonding with bonding load of about 300 g/bump. With applying 5W through heater on the device, the maximum temperature with Ag paste bonding was about $50^{\circ}C$. That with Au SBB on Au coated Si substrate showed $64^{\circ}C$. The difference of maximum temperatures is only $14^{\circ}C$, even though the difference of contact area between Ag paste bonding and Au SBB is by about 300 times and the simulation showed that the contact resistance might be one of the reasons.
에폭시 접착제의 경화거동 및 접합강도에 미치는 경화촉매제의 영향
김민수,김해연,유세훈,김종훈,김준기,Kim, Min-Su,Kim, Hae-Yeon,Yoo, Se-Hoon,Kim, Jong-Hoon,Kim, Jun-Ki 대한용접접합학회 2011 대한용접·접합학회지 Vol.29 No.4
Adhesive bonding is one of the most promising joining methods which may substitute for conventional metallurgical joining processes, such as welding, brazing and soldering. Curing behavior and mechanical properties of adhesive joint are largely dependent on the curing agent including hardener and catalyst. In this study, effects of curing system on the curing behavior and single-lap shear strength of epoxy adhesive joint are investigated. Dihydrazide, anhydride and dicyandiamide(DICY) were chosen as hardener and imidazole and triphenylphosphine(TPP) were chosen as catalyst. In curing behavior, TPP showed the delay of the curing rate for DICY and ADH at $160^{\circ}C$, compared to imidazole catalyst due to the high curing onset/peak temperature. DICY seemed to be most beneficial in the joint strength for both steel and Al adherends, although the type of adherends affected the shear strength of epoxy adhesive joint.
Sn-3.0Ag-0.5Cu 솔더범프의 금속간화합물 성장거동에 미치는 PCB 표면처리의 영향
정명혁,김재명,유세훈,이창우,박영배,Jeong, Myeong-Hyeok,Kim, Jae-Myeong,Yoo, Se-Hoon,Lee, Chang-Woo,Park, Young-Bae 한국마이크로전자및패키징학회 2010 마이크로전자 및 패키징학회지 Vol.17 No.1
Thermal annealing and electromigration test were performed at $150^{\circ}C$ and $4{\times}10^3\;A/cm^2$ conditions in order to investigate the effect of PCB surface finishs on the growth kinetics of intermetallic compound (IMC) in Sn-3.0Ag-0.5Cu solder bump. The surface finishes of the electrodes of printed circuit board (PCB) were organic solderability preservation (OSP), immersion Sn, and electroless Ni/immersion gold (ENIG). During thermal annealing, the OSP and immersion Sn show similar IMC growth velocity, while ENIG surface finish had much slower IMC growth velocity. Applying electric current accelerated IMC growth velocity and showed polarity effect due to directional electron flow. Sn-3.0Ag-0.5Cu 솔더범프의 금속간화합물 성장거동에 미치는 PCB 표면처리의 영향을 알아보기 위해서 PCB 패드 표면에 각각 OSP, immersion Sn, 그리고 ENIG를 처리하였고, 열처리는 $150^{\circ}C$ 조건에서 실험을 실시하였다. 또한, 전류인가시 Sn-3.0Ag-0.5Cu 솔더범프의 접합부 계면반응에 미치는 표면처리의 영향을 알아보기 위해서 $150^{\circ}C$, $4{\times}10^3\;A/cm^2$ 조건에서 electromigration특성을 비교 평가하였다. 열처리시 OSP와 immersion Sn의 금속간화합물 성장거동은 서로 비슷한 경향을 보인 반면, ENIG는 다른 표면처리에 비해 훨씬 느린 성장거동을 보였다. electromigration특성 평가결과 열처리에 비해 금속간화합물의 성장이 가속화되나 표면처리별 경향은 유사하였고, 전자 이동 방향에 따른 음극-양극에서 금속간화합물 형성의 차이를 보이는 극성효과(polarity effect)가 나타나는 것을 알 수 있었다.
Ball Grid Array 보드 어셈블리의 동적굽힘 신뢰성에 미치는 언더필의 영향
장재원,방정환,유세훈,김목순,김준기,Jang, Jae-Won,Bang, Jung-Hwan,Yoo, Se-Hoon,Kim, Mok-Soon,Kim, Jun-Ki 한국재료학회 2011 한국재료학회지 Vol.21 No.12
In this paper, the effects of conventional and newly developed elastomer modified underfill materials on the mechanical shock reliability of BGA board assembly were studied for application in mobile electronics. The mechanical shock reliability was evaluated through a three point dynamic bending test proposed by Motorola. The thermal properties of the underfills were measured by a DSC machine. Through the DSC results, the curing condition of the underfills was selected. Two types of underfills showed similar curing behavior. During the dynamic bending reliability test, the strain of the PCB was step increased from 0.2% to 1.5% until the failure circuit was detected at a 50 kHz sampling rate. The dynamic bending reliability of BGA board assembly using elastomer modified underfill was found to be superior to that of conventional underfill. From mechanical and microstructure analyses, the disturbance of crack propagation by the presence of submicron elastomer particles was considered to be mainly responsible for that result rather than the shear strength or elastic modulus of underfill joint.